Deposition covers a wide variety of methods that are used to add a wide variety of materials. The subcategories here can be useful to help narrow down your search.

  • Atomic Layer Deposition (ALD) is used to deposit less than 50nm of highly conformal films.
  • Chemical Vapor Deposition (CVD) is used to deposit films less than 5μm thick, carbon nanotubes, and graphene.
  • Deposited III-N uses a type of CVD called MOCVD to deposit the nitrides of materials that are found in group III of the periodic table.
  • Deposited III-V uses a type of CVD called MOCVD to deposit combinations of materials from group III and group V of the periodic table.
  • Ink lists the equipment that can be used to print inks that are either commercially available or made by the user.
  • Physical Vapor Deposition (PVD) is used to deposit primarily metal layers as well as some dielectrics.
Processing Techniques Equipment name & NEMO ID Teaser Blurb Cleanliness Location
Graphene CVD Growth Aixtron Black Magic graphene CVD furnace
aixtron-graphene 		Flexible SNF Exfab Paul G Allen L119 Año Nuevo
Metal-Organic (MO) CVD Aixtron MOCVD - III-N system
aix-ccs

Aixtron MOCVD for III-N semiconductors: InN, GaN, AlN, InGaN, InAlN, AlGaN, InGaAlN. Aix-ccs is a vertical metal organic chemical vapor deposition (MOCVD) system.

 Clean (MOCVD) SNF MOCVD Paul G Allen 213XA
Metal-Organic (MO) CVD Aixtron MOCVD - III-V system
aix200 		Flexible SNF MOCVD Paul G Allen 213XA
Evaporation AJA Evaporator
aja-evap 		Flexible SNF Exfab Paul G Allen 155A Venice
Evaporation AJA2 Evaporator
aja2-evap

This E-beam evaporator can evaporate a variety of metals (no oxides) onto your substrates. It has an integrated ion mill for substrate precleaning. 

 Flexible SNF Paul G Allen L107 Cleanroom
EPI (CVD), Low Pressure (LP) CVD, Hydrogen (H2) Annealing, Doping, Plasma Enhanced (PE) CVD AMAT Centurion Epitaxial System
epi2

Deposit epitaxial and polycrystalline silicon, germanium and silicon-germanium films.

 Clean SNF Paul G Allen L107 Cleanroom
Evaporation CHA Solutions II Evaporator
cha-evap

cha-evap is a non-load locked e-beam evaporator designed for higher throughput.

Flexible SNF Paul G Allen L107 Cleanroom
Plasma Enhanced (PE) ALD Fiji 1 ALD
fiji1

Fiji1 is a load-locked, plasma-enabled atomic layer deposition (ALD) system.

 Semiclean SNF Paul G Allen L107 Cleanroom
Plasma Enhanced (PE) ALD Fiji 2 ALD
fiji2

Fiji2 is a load-locked, plasma-enabled atomic layer deposition (ALD) system. Fiji2 is currently classified as Flexible and is open to a wide range of metals and dielectrics.

 Flexible SNF Paul G Allen L107 Cleanroom
Plasma Enhanced (PE) ALD Fiji 3 ALD
fiji3

The Fiji3 ALD system from Cambridge Nanotech/Ultratech is a plasma enabled atomic layer deposition system for deposition of restricted oxide films. The system is in the Flexible cleanliness category and allows a limited subset of gold contaminated substrates.

 Flexible SNF Paul G Allen L107 Cleanroom
Carbon Nanotube CVD Growth First Nano carbon nanotube CVD furnace
cvd-nanotube 		Flexible SNF Exfab Paul G Allen L119 Año Nuevo
Ink Fujifilm Dimatix Ink Jet Printer
nanoinkjet 		Flexible SNF Exfab Paul G Allen 155 Mavericks
Sputtering Hummer V Sputter Coater
hummer 		Flexible SNF Exfab Paul G Allen 104 Stinson
Evaporation Intlvac Evaporator
Intlvac_evap 		Clean, Semiclean SNF Paul G Allen L107 Cleanroom
Sputtering Lesker Sputter
lesker-sputter 		Flexible SNF Exfab Paul G Allen 155A Venice
Sputtering Lesker2 Sputter
lesker2-sputter 		Semiclean SNF Paul G Allen L107 Cleanroom
Thermal ALD MVD
mvd

MVD is a molecular vapor deposition (MVD) system. It is a self assembling monolayers (SAMs)-based configuration of a Savannah S200 from Cambridge Nanotech with 1 SAMs delivery port and 4 standard atomic layer deposition (ALD) lines.  The system can accommodate pieces up to an 8" wafer.

 Flexible SNF Paul G Allen L107 Cleanroom
Ink Optomec Printer
optomec-printer 		Flexible SNF Exfab Paul G Allen 155A Venice
Plasma Enhanced (PE) CVD Oxford Plasma Pro PECVD
Ox-PECVD

Ox-PECVD is dual frequnency plasma deposition system that can do silicon dioxide, amorphous, Oxynitride, silicon carbide and multi stress Nitride. 

 Semiclean, Flexible SNF Paul G Allen L107 Cleanroom
Deposition PDMS Workbench Flexible SNF Exfab Paul G Allen 155 Mavericks

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