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Argon
Chemical Formula:
Ar
Gases Equipment Tabs
Etch Equipment Table
(active tab)
Anneal/Oxidation Equipment Table
Etch Equipment Table
Equipment name or Badger ID
Partial words okay.
Equipment name & Badger ID
Cleanliness
Location
Primary Materials Etched
Other Materials Etched
Gases
Etch Equipment
Equipment name & Badger ID
Cleanliness
Location
Primary Materials Etched
Other Materials Etched
Gases
AMAT P5000 Etcher
p5000etch
Clean
Clean (Ge)
Semiclean
SNF Paul G Allen L107 Cleanroom
Si
Si3N4
SiGe
SiO
2
SiON
C
C
C
dimethylpolysiloxane
poly(p-xylylene)
SiC
Ti
Various C-based
W
WSi
2
PI
Resist
Ti Tungsten
80% He/ 20%O
2
Ar
CF
4
CHF
3
Cl
2
HBr
He
N
2
NF
3
O
2
SF
6
MRC Reactive Ion Etcher
mrc
Flexible
SNF Paul G Allen L107 Cleanroom
Metals
Various Dielectrics
Metal oxides
PI
Ar
CHClF
2
CHF
3
O
2
SF
6
Oxford Dielectric Etcher
oxford-rie
Flexible
SNF Paul G Allen L107 Cleanroom
Si3N4
SiC
SiO
2
PI
C
Ar
CF
4
CHF
3
N
2
O
2
SF
6
Oxford III-V etcher
Ox-35
Flexible
SNF Paul G Allen L107 Cleanroom
GaAs
AlGaN
AlInP
GaN
InGaP
InSb
Ar
BCl
3
CH
4
Cl
2
H
2
HBr
N
2
O
2
SF
6
Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE
Flexible
SNF Paul G Allen L107 Cleanroom
Si
Ar
C
4
F
8
O
2
SF
6
Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox
Flexible
SNF Paul G Allen L107 Cleanroom
C
Si3N4
SiC
SiO
2
Various C-based
Ar
C
4
F
8
CF
4
CHF
3
H
2
He
N
2
O
2
Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Flexible
SNF Paul G Allen L107 Cleanroom
Metals or metal compounds with volatile byproducts
Al
GaN
Ar
BCl
3
CF
4
CH
4
Cl
2
N
2
O
2
SF
6
Anneal/Oxidation Equipment Table
Equipment name or Badger ID
Partial words okay.
Equipment name & Badger ID
Cleanliness
Location
Material Thickness Range
Approved Materials supplied by Lab
Deposition Equipment
Equipment name & Badger ID
Cleanliness
Location
Material Thickness Range
Approved Materials supplied by Lab
Fiji 1 ALD
fiji1
Semiclean
SNF Paul G Allen L107 Cleanroom
1.00 Å
-
50.00 nm
Metal oxides
Al
2
O
3
HfN
HfO
2
Pt
Ru
SiO
2
Ta
2
O
5
TaN
TiN
TiO
2
Various Dielectrics
ZrO
2
Fiji 2 ALD
fiji2
Flexible
SNF Paul G Allen L107 Cleanroom
1.00 Å
-
50.00 nm
Metal oxides
Al
2
O
3
Ga
2
O
3
HfN
HfO
2
In
2
O
3
In
x
Sn
y
O
z
MoO
3
Ni
x
O
y
Pt
Ru
Si3N4
SiO
2
SnO
2
SrO
Ta
2
O
5
TiN
TiO
2
Various Dielectrics
ZrO
2
Fiji 3 ALD
fiji3
Flexible
SNF Paul G Allen L107 Cleanroom
1.00 Å
-
50.00 nm
Al
2
O
3
HfO
2
SiO
2
TiO
2
Various Dielectrics
First Nano carbon nanotube CVD furnace
cvd-nanotube
Flexible
SNF Exfab Paul G Allen L119 Año Nuevo
C
KJL Evaporator 1
SNSF NPC Spilker suite 6
200.00 nm
Al
Au
Cr
Cu
Ge
Ni
Pd
Pt
Ti
V
Lesker2 Sputter
lesker2-sputter
Semiclean
SNF Paul G Allen L107 Cleanroom
1.00 μm
Ag
Al
Al
2
O
3
AlSi
Cr
Ge
In
x
Sn
y
O
z
Mo
Pd
Ru
Sc
Si
SiO
2
Sn
Ta
Ti
TiN
W
MVD
mvd
Flexible
SNF Paul G Allen L107 Cleanroom
1.00 Å
-
50.00 nm
Al
2
O
3
C
21
H
46
O
3
Si
C
9
H
23
NO
3
Si
HfO
2
HN(CH
2
CH
2
NH
2
)
2
Various
Various Dielectrics
PlasmaTherm Versaline HDP CVD System
hdpcvd
All
SNF Paul G Allen L107 Cleanroom
500.00 Å
-
4.00 μm
Si
Si3N4
SiC
SiO
2
SiON
RTA AllWin 610
aw610_l
Clean
SNF Paul G Allen L107 Cleanroom
RTA AllWin 610
aw610_r
Flexible
SNF Paul G Allen L107 Cleanroom