Chemical Formula:
SiO2
Stanford Nanofabrication Facility
Lab User Guide
Equipment Tables
| Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Process Temperature Range | Gases | Sample Size Limits | Substrate Size | Substrate Type | Maximum Load |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Flexible | |||||||||||
|
PlasmaTherm Shuttlelock PECVD System ccp-dep |
"All" |
100.00 Å -
4.00 μm
|
100 °C - 350 °C
|
4 | ||||||||
|
Probe Station P200L Probe Station P200L |
"All" | 1 | ||||||||||
|
Profilometer Alphastep 500 alphastep |
Flexible | 1 | ||||||||||
|
Profilometer AlphaStep D-300 alphastep2 |
Flexible | 1 | ||||||||||
| Prometrix Resistivity Mapping System | 1 | |||||||||||
|
Samco PC300 Plasma Etch System samco |
Flexible |
20 ºC
|
Four 4" wafers or two 6" wafers and one 8" wafer | |||||||||
|
Savannah ALD savannah |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 250 °C
|
|||||||||
|
SEM -Zeiss Merlin sem-merlin |
"All" |
0.00 mm -
35.00 mm
|
6 in wafer | one | ||||||||
|
Sensofar S-neox s-neox |
"All" | 1 |