The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.
The following is a list of equipment that fall into the "Flexible" category.
Stanford Nanofabrication Facility
Lab User Guide
Equipment Tables
| Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Materials Lab Supplied | Process Temperature Range | Gases | Substrate Size | Substrate Type | Maximum Load |
|---|---|---|---|---|---|---|---|---|---|---|
|
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Flexible | |||||||||
|
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Flexible | 1 | ||||||||
|
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox |
Flexible | 1 | ||||||||
|
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Flexible | 1 | ||||||||
|
Plasmaetch PE-50 plasma-etch |
Flexible | Multiple | ||||||||
|
Profilometer Alphastep 500 alphastep |
Flexible | 1 | ||||||||
|
Profilometer AlphaStep D-300 alphastep2 |
Flexible | 1 | ||||||||
|
QSonica Q700 Sonicator sonicator |
Flexible | |||||||||
|
RTA AllWin 610 aw610_r |
Flexible |
21 °C - 1150 °C
|
||||||||
|
Samco PC300 Plasma Etch System samco |
Flexible |
20 ºC
|
Four 4" wafers or two 6" wafers and one 8" wafer |