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Materials
Overview
Chemicals & Materials
Cleanliness Groups
"All" List of Tools
"Clean" List of Tools
"Clean-Ge" List of Tools
"Clean (MOCVD)" List of Tools
"Semiclean" List of Tools
"Flexible" List of Tools
New Process or Material Requests (PROM)
ProM Committee
ProM Approach
TMAH Protocols
TMAH Checklist
PROM (PRocess and Materials) Form
PROM archive view
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Resists
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Forming gas 4%
Chemical Formula:
4% H
2
in N
2
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(active tab)
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Etch Equipment Table
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Anneal/Oxidation Equipment Table
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Equipment name & Badger ID
Cleanliness
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Approved Materials supplied by Lab
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Equipment name & Badger ID
Cleanliness
Location
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Approved Materials supplied by Lab
RTA AllWin 610
aw610_l
Clean
SNF Paul G Allen L107 Cleanroom
RTA AllWin 610
aw610_r
Flexible
SNF Paul G Allen L107 Cleanroom
Tystar Bank 1 Tube 1 Anneal
B1T1 Flexible Oxide
Flexible
SNF Paul G Allen L107 Cleanroom
25.00 Å
-
2.00 μm
Tystar Bank 1 Tube 2
B1T2 Flexible Oxide
Flexible
SNF Paul G Allen L107 Cleanroom
25.00 Å
-
2.00 μm
SiO
2
Tystar Bank 2 Tube 5
B2T5 Clean Anneal
Clean
SNF Paul G Allen L107 Cleanroom
25.00 Å
-
2.00 μm
Tystar Bank 2 Tube 6
B2T6 Clean Oxide
Clean
SNF Paul G Allen L107 Cleanroom
25.00 Å
-
2.00 μm
SiO
2
Tystar Bank 3 Tube 9
B3T9 Clean Oxide
Clean
SNF Paul G Allen L107 Cleanroom
25.00 Å
-
2.00 μm
SiO
2
