The following is a list of equipment where 4 inch round substrates are allowed.
The following is a list of equipment where 4 inch round substrates are allowed.
|
Equipment name & NEMO ID |
Training Required & Charges | Cleanliness | Location | Notes |
|---|---|---|---|---|
|
Optomec Printer optomec-printer |
Flexible | SNF Exfab Paul G Allen 155A Venice | ||
|
Oven (White) white-oven |
White Oven Training | Flexible | SNF Paul G Allen L107 Cleanroom |
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable. |
|
Oven 110°C post-bake oven110 |
Resist Postbake Oven 110°C Training | "All" | SNF Paul G Allen L107 Cleanroom |
Bakes wafers with resist after the development, called post-bake. |
|
Oven 90°C prebake oven90 |
Resist Prebake Oven 90°C Training | "All" | SNF Paul G Allen L107 Cleanroom |
Bakes wafers after resist coating. |
|
Oven BlueM 200°C to 430°C bluem |
Blue M Oven Training | Flexible | SNF Paul G Allen L107 Cleanroom |
Convection in N2. Cure. Programmable. |
|
Oxford Dielectric Etcher oxford-rie |
Oxford Dielectric Etcher Training | Flexible | SNF Paul G Allen L107 Cleanroom |
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers |
|
Oxford III-V etcher Ox-35 |
Oxford III-V etcher Training | Flexible | SNF Paul G Allen L107 Cleanroom |
Metal etching or Metal hard masks are not allowed. 4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only. |
|
Oxford Plasma Pro ICP-RIE Ox-gen |
Ox-gen etcher Training | Flexible | SNF Paul G Allen L107 Cleanroom | |
|
Oxford Plasma Pro ICP-RIE ALE Ox-ALE |
Oxford Plasma Pro ICP-RIE ALE Training | Flexible | SNF Paul G Allen L107 Cleanroom | |
|
Oxford Plasma Pro ICP-RIE Ox Ox-Ox |
Oxford Plasma Pro ICP-RIE Ox Training | Clean | SNF Paul G Allen L107 Cleanroom | |
|
Oxford Plasma Pro PECVD Ox-PECVD |
Oxford Plasma Pro PECVD Training | Semiclean, Flexible | SNF Paul G Allen L107 Cleanroom | |
|
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Parylene Coater Training | Flexible | SNF Exfab Paul G Allen 155 Mavericks | |
|
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Plasma Therm Versaline LL ICP Deep Silicon Etcher Training | Flexible | SNF Paul G Allen L107 Cleanroom |
Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching |
|
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox |
Plasma Therm Versaline LL ICP Dielectric Etcher Training | Flexible | SNF Paul G Allen L107 Cleanroom |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues) |
|
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Plasma Therm Versaline LL ICP Metal Etcher Training | Flexible | SNF Paul G Allen L107 Cleanroom |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues) |
|
Plasmaetch PE-50 plasma-etch |
Plasmaetch PE-50 Training | Flexible | SNF Exfab Paul G Allen 155A Venice |
Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment. |
|
PlasmaTherm Shuttlelock PECVD System ccp-dep |
PlasmaTherm Shuttlelock PECVD System Training | "All" | SNF Paul G Allen L107 Cleanroom |
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing - Substrates in clean category: Pre-Diffusion Clean For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run |
|
PlasmaTherm Versaline HDP CVD System hdpcvd |
PlasmaTherm Versaline HDP CVD System Training | "All" | SNF Paul G Allen L107 Cleanroom |
To maintain cleanliness level there are cleans required for both the chamber and wafers prior to processing - Substrates in clean category: Pre-Diffusion Clean For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run |
|
Profilometer Alphastep 500 alphastep |
Alphastep 500 Profilometer Training | Flexible | SNF Exfab Paul G Allen 104 Stinson |
500Å to 300µm |
|
Profilometer AlphaStep D-300 alphastep2 |
AlphaStep2 Training | Flexible | SNF Exfab Paul G Allen 104 Stinson |