Equipment name & NEMO ID | Training Required & Charges | Cleanliness | Location | Notes |
---|---|---|---|---|
Nanospec 3 nanospec3 |
Nanospec 3 Training | All | SNF Cleanroom Paul G Allen L107 | |
Optomec Printer optomec-printer |
Optomec Printer Training | Flexible | SNF Exfab Paul G Allen 155A Venice | |
Oven (White) white-oven |
White Oven Training | Flexible | SNF Cleanroom Paul G Allen L107 |
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable. |
Oven 110°C post-bake oven110 |
Resist Postbake Oven 110°C Training | All | SNF Cleanroom Paul G Allen L107 |
Bakes wafers with resist after the development, called post-bake. |
Oven 90°C prebake oven90 |
Resist Prebake Oven 90°C Training | All | SNF Cleanroom Paul G Allen L107 |
Bakes wafers after resist coating. |
Oven BlueM 200°C to 430°C bluem |
Blue M Oven Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Convection in N2. Cure. Programmable. |
Oxford Dielectric Etcher oxford-rie |
Oxford Dielectric Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers |
Oxford III-V etcher Ox-35 |
Oxford III-V etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Metal etching or Metal hard masks are not allowed. 4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only. |
Oxford Plasma Pro ICP-RIE Ox-gen |
Ox-gen etcher Training | Clean | SNF Cleanroom Paul G Allen L107 | |
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Parylene Coater Training | Flexible | SNF Exfab Paul G Allen 155 Mavericks | |
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Plasma Therm Versaline LL ICP Deep Silicon Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching |
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox |
Plasma Therm Versaline LL ICP Dielectric Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues) |
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Plasma Therm Versaline LL ICP Metal Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues) |
Plasmaetch PE-50 plasma-etch |
Plasmaetch PE-50 Training | Flexible | SNF Exfab Paul G Allen 155 Mavericks |
Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment At SNF - nSiL lab |
PlasmaTherm Shuttlelock PECVD System ccp-dep |
PlasmaTherm Shuttlelock PECVD System Training | All | SNF Cleanroom Paul G Allen L107 |
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing - Substrates in clean category: Pre-Diffusion Clean For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run |
PlasmaTherm Versaline HDP CVD System hdpcvd |
PlasmaTherm Versaline HDP CVD System Training | All | SNF Cleanroom Paul G Allen L107 |
To maintain cleanliness level there are cleans required for both the chamber and wafers prior to processing - Substrates in clean category: Pre-Diffusion Clean For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run |
Profilometer Alphastep 500 alphastep |
Alphastep 500 Profilometer Training | Flexible | SNF Exfab Paul G Allen 104 Stinson |
500Å to 300µm |
Profilometer AlphaStep D-300 alphastep2 |
AlphaStep2 Training | Flexible | SNF Exfab Paul G Allen 104 Stinson | |
Prometrix Resistivity Mapping System prometrix |
Prometrix Training | All | SNF Cleanroom Paul G Allen L107 |
3 Probe Heads for different cleanliness groups. |
RTA AllWin 610 aw610_r |
AllWin 610 RTA Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Process Temperature Range | Gases | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|
Nanospec 3 nanospec3 |
All | ||||||||||
Optomec Printer optomec-printer |
Flexible | ||||||||||
Oven (White) white-oven |
Flexible |
0 °C - 200 °C
|
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Oven 110°C post-bake oven110 |
All |
110 ºC
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Oven 90°C prebake oven90 |
All |
90 ºC
|
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Oven BlueM 200°C to 430°C bluem |
Flexible |
0 °C - 430 °C
|
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Oxford Dielectric Etcher oxford-rie |
Flexible |
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1 | ||||||||
Oxford III-V etcher Ox-35 |
Flexible | 1 | |||||||||
Oxford Plasma Pro ICP-RIE Ox-gen |
Clean |
-10 °C - 60 °C
|
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1 | |||||||
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Flexible |
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Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Flexible | 1 | |||||||||
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox |
Flexible | 1 | |||||||||
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Flexible | 1 | |||||||||
Plasmaetch PE-50 plasma-etch |
Flexible | Multiple | |||||||||
PlasmaTherm Shuttlelock PECVD System ccp-dep |
All |
100.00 Å -
4.00 μm
|
100 °C - 350 °C
|
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4 | ||||||
PlasmaTherm Versaline HDP CVD System hdpcvd |
All |
500.00 Å -
4.00 μm
|
50 °C - 150 °C
|
1 | |||||||
Profilometer Alphastep 500 alphastep |
Flexible |
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1 | ||||||||
Profilometer AlphaStep D-300 alphastep2 |
Flexible |
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1 | ||||||||
Prometrix Resistivity Mapping System prometrix |
All |
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1 | ||||||||
RTA AllWin 610 aw610_r |
Flexible |
21 °C - 1150 °C
|
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