The following is a list of equipment where 4 inch round substrates are allowed.
Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment.
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
To maintain cleanliness level there are cleans required for both the chamber and wafers prior to processing -
500Å to 300µm
3 Probe Heads for different cleanliness groups.
non contact 3D optical profiling
Pieces need a carrier wafer; Isotropic Etching
Automatic development.
Automatic Resist spinning and bake
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.