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Wet Chemical Equipment Summary

Wet Bench Equipment

Equipment name (NEMO ID)sort descending Processing Techniques Chemicals Primary Materials Etched Substrate Size Cleanliness Notes
Critical Point Dryer Tousimis Automegasamdri-915B (cpd) CO2 Drying, Wet Chemical Processing CO2 (liquid) Flexible

CO2 drying after release of micromachined devices

Ex Fab Solvent Wet Bench (wbexfab_solv) Solvent Cleaning, Metal Lift-off, Wet Chemical Processing Solvents Flexible
Mask Scrubber (masksrub) Mask Cleaning (manual), Wet Chemical Processing DI Water All

5 inch mask cleaning, water under pressure, no chemicals

Wet Bench Clean 1 (wbclean-1) Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing 50:1 Hydrofluoric Acid, Standard Clean 1, Standard Clean 2
Clean

No resist allowed. Resist should have been removed at the wbclean_res-piranha.

Wet Bench Clean 2 (wbclean-2) Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing 6:1 Buffered oxide etch, 50:1 Hydrofluoric Acid, Standard Clean 1, Standard Clean 2
Clean

No resist allowed. Resist should have been removed at the wbclean_res-piranha

Wet Bench Clean_res- hotphos (wbclean_res-hotphos) Silicon Nitride Wet Etching, Wet Chemical Processing Silicon Nitride
Clean

Resist should have been removed

Wet Bench Clean_res-hf (wbclean_res-hf) Silicon Oxide Wet Etching, Wet Chemical Processing 20:1 Buffered oxide etch, 6:1 Buffered oxide etch, 50:1 Hydrofluoric Acid Silicon Dioxide
Clean

Resist as mask allowed

Wet Bench Clean_res-piranha (wbclean_res-piranha) Piranha Cleaning, Wet Resist Removal, Wet Chemical Processing 9:1 Piranha Solution
Clean

Resist will be removed

Wet Bench CMOS Metal (wbclean3) Aluminum and Titanium and Tungsten Wet Etching, Wet Chemical Processing 20:1 Buffered oxide etch, 6:1 Buffered oxide etch, 50:1 Hydrofluoric Acid, Aluminum Etchant, Titanium (Ti) etchant Peroxide-based, Tungsten (W) etchant Peroxide-based Aluminum, Titanium, Tungsten
Semiclean

Al, Ti, or W wet etching or oxide etching

Wet Bench Decontamination (wbdecon) Decontamination, Wet Chemical Processing Standard Clean 2
Clean

KOH or wafersaw or post-cmp decontamination

Wet Bench Flexcorr 1 (wbflexcorr-1) Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing Acids, 20:1 Buffered oxide etch, 6:1 Buffered oxide etch, 9:1 Piranha Solution, 50:1 Hydrofluoric Acid, Standard Clean 1, Standard Clean 2, Aluminum Etchant, Chromium Etchant, Gold Etchant, Bases, Potassium Hydroxide 45% Photoresist, Metals, Silicon Dioxide, Silicon, Aluminum, Chromium, Gold Flexible

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.

Wet Bench Flexcorr 2 (wbflexcorr-2) Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Acids, Bases Flexible

Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only

Wet Bench Flexcorr 3 (wbflexcorr-3) Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Acids, Bases Flexible

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.

Wet Bench Flexcorr 4 (wbflexcorr-4) Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Acids, Bases Flexible

Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.

Wet Bench Flexible Solvents (wbflexsolv) Solvent Cleaning, Wet Resist Removal, Metal Lift-off Solvents Flexible

Manual solvent cleaning of substrates or resist removal.

Wet Bench Flexible Solvents 1 (wbflexsolv-1) Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing Solvents Flexible

Manual solvent cleaning, two ultrasonic baths.

Wet Bench Flexible Solvents 2 (wbflexsolv-2) Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing Solvents Flexible

Manual solvent cleaning, hot plate

Wet Bench Miscellaneous (wbmiscres) Resist Develop (manual), Wet Chemical Processing Developers Flexible

Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!

Wet Bench Resist Strip (wbresstrip-1) Wet Resist Removal, Wet Chemical Processing PRS-1000, SRS-100 Photoresist Clean (Ge), Semiclean, Flexible

Wet Resist Removal: SRS-100 or PRS1000

Wet Bench Solvent Lithography (lithosolv) Solvent Cleaning, Wet Chemical Processing Solvents Flexible

Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.

Last modified: 5 Aug 2024