The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.
The following is a list of equipment that fall into the "Flexible" category.
Stanford Nanofabrication Facility
Lab User Guide
Equipment Tables
| Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Process Temperature Range | Gases | Substrate Size | Substrate Type | Maximum Load |
|---|---|---|---|---|---|---|---|---|---|---|---|
|
Savannah ALD savannah |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 250 °C
|
||||||||
|
Sinton Lifetime Tester sinton-lifetime-tester |
Flexible | ||||||||||
|
Solidscape Wax 3D Printer 3d-wax-printer |
Flexible | ||||||||||
|
Technics Asher technics |
Flexible | Four 4" wafers to pieces, one 6" or 8" wafer | |||||||||
|
Thermoscientific Oven thermoscientific-oven |
Flexible | ||||||||||
|
Thinky AR-100 Mixer thinky-mixer |
Flexible | ||||||||||
|
Tystar Bank 1 Tube 1 Anneal B1T1 Flexible Oxide |
Flexible |
25.00 Å -
2.00 μm
|
400 °C - 1100 °C
|
100 | |||||||
|
Tystar Bank 1 Tube 2 B1T2 Flexible Oxide |
Flexible |
25.00 Å -
2.00 μm
|
400 °C - 1100 °C
|
100 | |||||||
|
Tystar Bank 1 Tube 3 Poly B1T3 Flexible Poly |
Flexible |
25.00 Å -
2.00 μm
|
420 °C - 630 °C
|
100 | |||||||
|
Tystar Bank 1 Tube 4 LTO B1T4 Flexible LTO |
Flexible |
25.00 Å -
2.00 μm
|
300 °C - 500 °C
|
100 |