Chemical Formula:
SiO2
Stanford Nanofabrication Facility
Lab User Guide
Equipment Tables
| Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Materials User Supplied | Minimum Resolution | Exposure Wavelength | Mask Size | Max Exposure Area | Process Temperature Range | Gases | Sample Size Limits | Resolution Notes | Substrate Size | Substrate Type | Maximum Load |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Karl Suss MA-6 Contact Aligner karlsuss2 |
"All" |
|
365 nm or 405 nm | 4 inch, 5 inch, 7 inch | 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch | |||||||||||||
|
Keyence Digital Microscope VHX-6000 keyence |
"All" | |||||||||||||||||
|
Lakeshore Hall Measurement System LakeshoreHall |
"All" |
100.00 μm -
1000.00 μm
|
-258 °C - 1000 °C
|
8 in wafer |
Sensor Transducer Size is 14 mm diameter |
1 piece | ||||||||||||
|
LEI1500 Contactless Sheet Resistance Mapping eddycurrent |
"All" | 8 in wafer |
Sensor Transducer Size is 14 mm diameter |
1 wafer(2" to 8") | ||||||||||||||
|
Lesker Sputter lesker-sputter |
Flexible | 1 4 inch wafer, 1 6 inch wafer | ||||||||||||||||
|
Lesker2 Sputter lesker2-sputter |
Semiclean |
1.00 μm
|
°C - 800 °C
|
one 4 inch wafer, one 6 inch wafer | ||||||||||||||
|
Matrix Plasma Resist Strip matrix |
Flexible | 25 | ||||||||||||||||
|
Micromanipulator6000 IV-CV probe station micromanipulator6000 |
"All" | 1x4" wafer | ||||||||||||||||
|
Nanospec 210XP nanospec2 |
"All" | |||||||||||||||||
|
Oven (White) white-oven |
Flexible |
0 °C - 200 °C
|