"All"

Bakes wafers with resist after the development, called post-bake.

Spray coating of resists

1:1 Contact Aligner. Backside align, including IR.

To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

Pieces need a carrier wafer; Isotropic Etching

Automatic Resist spinning and bake

Automatic development.