| Equipment name & NEMO ID | Technique | Cleanliness | Material Thickness Range | Materials Lab Supplied | Minimum Resolution | Exposure Wavelength | Mask Size | Resist | Process Temperature Range | Chemicals | Gases | Substrate Size | Substrate Type | Maximum Load |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AJA Evaporator aja-evap |
Flexible |
0.00 -
300.00 nm
|
4"x3 or 6"x1 wafers or pieces | |||||||||||
|
AJA2 Evaporator aja2-evap |
Flexible |
0.00 -
300.00 nm
|
4"x3 or 6"x1 wafers or pieces | |||||||||||
|
ASML PAS 5500/60 i-line Stepper asml |
"All" |
|
365 nm | 5 inch | ||||||||||
|
CHA Solutions II Evaporator cha-evap |
Flexible |
0.00 -
300.00 nm
|
4"x15 or 6"x3 wafers or pieces | |||||||||||
|
Critical Point Dryer Tousimis Automegasamdri-936 cpd |
Flexible | |||||||||||||
|
EVG 101 Spray Coater evgspraycoat |
"All" | 1 | ||||||||||||
|
Fiji 1 ALD fiji1 |
Semiclean |
1.00 Å -
50.00 nm
|
24 °C - 350 °C
|
|||||||||||
|
Fiji 2 ALD fiji2 |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 350 °C
|
|||||||||||
|
Fiji 3 ALD fiji3 |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 350 °C
|
|||||||||||
|
Finetech Lambda flipchipbonder |
Flexible |
°C - 400 °C
|
1 |