Chemical Formula:
Si
Stanford Nanofabrication Facility
Lab User Guide
Equipment Tables
| Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Minimum Resolution | Exposure Wavelength | Resist | Process Temperature Range | Gases | Substrate Size | Substrate Type | Maximum Load |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Fiji 1 ALD fiji1 |
Semiclean |
1.00 Å -
50.00 nm
|
24 °C - 350 °C
|
|||||||||||
|
Fiji 2 ALD fiji2 |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 350 °C
|
|||||||||||
|
Fiji 3 ALD fiji3 |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 350 °C
|
|||||||||||
|
Filmetrics 4PP Filmetrics 4PP |
"All" | 1 | ||||||||||||
|
Finetech Lambda flipchipbonder |
Flexible |
°C - 400 °C
|
1 | |||||||||||
|
First Nano carbon nanotube CVD furnace cvd-nanotube |
Flexible |
800 °C - 1100 °C
|
1x4" wafer or multiple pieces | |||||||||||
|
Flexus 2320 Stress Tester stresstest |
"All" | 1 | ||||||||||||
|
Gasonics Aura Asher gasonics |
Clean, Semiclean | 25 | ||||||||||||
|
Headway Manual Resist Spinner headway2 |
"All" | one piece or wafer | ||||||||||||
|
Heidelberg MLA 150 heidelberg |
"All" |
|
405 nm | 1 |