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RIE Etchers

This is a summary of the RIE etchers.

If you would like to see a summary of etchers for a specific material (i.e. SiO2 or poly silicon) please visit the materials page.

Dry Etch Equipment Summary

Processing Technique: Reactive Ion Etching (RIE)
Equipment Name	Processing Technique	Cleanliness	Primary Materials Etched	Other Materials Etched	Gases	Substrate Size	Maximum Load	Notes
Plasmaetch PE-50 (plasma-etch)	Reactive Ion Etching (RIE)	Flexible	Resist		78% N₂, 21% O₂, ~1% Ar	Pieces 2" 3" 4" 6"	Multiple	Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment.
MRC Reactive Ion Etcher (mrc)	Reactive Ion Etching (RIE)	Flexible	Metal oxides Metals Metals or metal compounds with volatile byproducts Metals or metal compounds without volatile byproducts Au Ni poly(p-xylylene) Pt Si Si3N4 SiO₂ Ti Various 2D Materials Various Dielectrics Various polymers PI Resist	Al AlAs AlGaAs AlGaN AlInP AlN AlSi BiFeO₃ C C C Co CoFeB Cr Cu Er Fe Ga₂O₃ GaAs GaN GaP GaPN Ge Hf HfN III-N materials III-V materials In In₂O₃ InAlN InAs InGaAlN InGaAs InGaAsN InGaN InGaP InN InP InPN InSb Ir LaB₆ LiNb Nb Ni_xO_y NiSi Pd Ru Sc SiC SiGe SiO SiON Sn SnO₂ SrO SrRuO Ta Ta₂O₅ TaN TiN V Various C-based Various polymers W WO₃ WSi₂ Y ZnO₃ Zr ZrY Alumina AZO Hafnia ITO LLZO Moly Moly Oxide Poly Silicon Ti Tungsten Titania YSZ Zirconia	Ar CHClF₂ CHF₃ O₂ SF₆	Pieces 2" 3" 4" 6"	1	Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be...
Oxford Dielectric Etcher (oxford-rie)	Reactive Ion Etching (RIE)	Flexible	Si3N4 SiC SiO₂ PI	C	Ar CF₄ CHF₃ N₂ O₂ SF₆	4"	1	4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers

Processing Technique: Plasma Mode Etching
Equipment Name	Processing Technique	Cleanliness	Primary Materials Etched	Other Materials Etched	Gases	Substrate Size	Maximum Load	Notes
Samco PC300 Plasma Etch System (samco)	Plasma Mode Etching	Flexible	Resist	dimethylpolysiloxane Si Si3N4 SiO₂ SiON Various polymers PI	CF₄ O₂ SF₆	Pieces 2" 3" 4" 6" 8" Other	Four 4" wafers or two 6" wafers and one 8" wafer

Last modified: 30 Apr 2020