This is a summary of the RIE etchers.

If you would like to see a summary of etchers for a specific material (i.e. SiO2 or poly silicon) please visit the materials page.

Processing Technique: Reactive Ion Etching (RIE)
Equipment Name Processing Technique Cleanliness Primary Materials Etched Other Materials Etched Gases Substrate Size Maximum Load Notes
Plasmaetch PE-50 (plasma-etch) Reactive Ion Etching (RIE) Flexible
Multiple

Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment.
MRC Reactive Ion Etcher (mrc) Reactive Ion Etching (RIE) Flexible
1

Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be...

Oxford Dielectric Etcher (oxford-rie) Reactive Ion Etching (RIE) Flexible
1

4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers
Processing Technique: Plasma Mode Etching
Equipment Name Processing Technique Cleanliness Primary Materials Etched Other Materials Etched Gases Substrate Size Maximum Load Notes
Samco PC300 Plasma Etch System (samco) Plasma Mode Etching Flexible
Four 4" wafers or two 6" wafers and one 8" wafer