Skip to content
Skip to navigation
Stanford Nanofabrication Facility
Navigation menu
Home
Fluoroform
Chemical Formula:
CHF
3
Gases Equipment Tabs
Etch Equipment Table
Equipment name or Badger ID
Partial words okay.
Etch Equipment
Equipment name & Badger ID
Cleanliness
Location
Primary Materials Etched
Other Materials Etched
Gases
AMAT P5000 Etcher
p5000etch
Clean
Clean (Ge)
Semiclean
SNF Cleanroom Paul G Allen L107
Si
Si3N4
SiGe
SiO
2
SiON
C
C
C
dimethylpolysiloxane
poly(p-xylylene)
SiC
Ti
Various C-based
W
WSi
2
PI
Resist
Ti Tungsten
80% He/ 20%O
2
Ar
CF
4
CHF
3
Cl
2
HBr
He
N
2
NF
3
O
2
SF
6
MRC Reactive Ion Etcher
mrc
Flexible
SNF Cleanroom Paul G Allen L107
Metals
Various Dielectrics
Metal oxides
PI
Ar
CHClF
2
CHF
3
O
2
SF
6
Oxford Dielectric Etcher
oxford-rie
Flexible
SNF Cleanroom Paul G Allen L107
Si3N4
SiC
SiO
2
PI
C
Ar
CF
4
CHF
3
N
2
O
2
SF
6
Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox
Flexible
SNF Cleanroom Paul G Allen L107
C
Si3N4
SiC
SiO
2
Various C-based
Ar
C
4
F
8
CF
4
CHF
3
H
2
He
N
2
O
2
Anneal/Oxidation Equipment Table
Equipment name or Badger ID
Partial words okay.
No equipment matches all of the filter criteria you have set above.
