The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.
The following is a list of equipment that fall into the "Flexible" category.
Stanford Nanofabrication Facility
Lab User Guide
Equipment Tables
| Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Process Temperature Range | Gases | Substrate Size | Substrate Type | Maximum Load |
|---|---|---|---|---|---|---|---|---|---|---|---|
|
Oven (White) white-oven |
Flexible |
0 °C - 200 °C
|
|||||||||
|
Oven BlueM 200°C to 430°C bluem |
Flexible |
0 °C - 430 °C
|
|||||||||
|
Oxford Dielectric Etcher oxford-rie |
Flexible | 1 | |||||||||
|
Oxford III-V etcher Ox-35 |
Flexible | 1 | |||||||||
|
Oxford Plasma Pro ICP-RIE Ox-gen |
Flexible |
-10 °C - 60 °C
|
1 | ||||||||
|
Oxford Plasma Pro ICP-RIE ALE Ox-ALE |
Flexible |
0 °C - 40 °C
|
1 | ||||||||
|
Oxford Plasma Pro PECVD Ox-PECVD |
Semiclean, Flexible |
100.00 Å -
4.00 μm
|
200 °C - 350 °C
|
1 | |||||||
|
PDMS Hotplate hotplate-1 |
Flexible | ||||||||||
|
PDMS Spin Coater spincoat-g3p8 |
Flexible | ||||||||||
| PDMS Workbench | Flexible |