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Silicon Oxynitride

Chemical Formula:

SiON

Equipment Tabs

Deposition Equipment

Deposition Equipment
Equipment name & Badger ID	Cleanliness	Location	Material Thickness Range	Approved Materials supplied by Lab
PlasmaTherm Shuttlelock PECVD System ccp-dep	All	SNF Cleanroom Paul G Allen L107	100.00 Å - 4.00 μm	Si Si3N4 SiC SiO₂ SiON
PlasmaTherm Versaline HDP CVD System hdpcvd	All	SNF Cleanroom Paul G Allen L107	500.00 Å - 4.00 μm	Si Si3N4 SiC SiO₂ SiON
Tystar Bank 2 Tube 7 Nitride B2T7 Clean Nitride	Clean	SNF Cleanroom Paul G Allen L107	25.00 Å - 2.00 μm	Si3N4 SiON
Tystar Bank 3 Tube 10 Nitride B3T10 Clean Nitride	Clean	SNF Cleanroom Paul G Allen L107	25.00 Å - 2.00 μm	Si3N4 SiON

Etching Equipment

Etch Equipment
Equipment name & Badger ID	Cleanliness	Location	Primary Materials Etched	Other Materials Etched
AMAT P5000 Etcher p5000etch	Clean Clean (Ge) Semiclean	SNF Cleanroom Paul G Allen L107	Si Si3N4 SiGe SiO₂ SiON	C C C dimethylpolysiloxane poly(p-xylylene) SiC Ti Various C-based W WSi₂ PI Resist Ti Tungsten
Samco PC300 Plasma Etch System samco	Flexible	SNF Cleanroom Paul G Allen L107	Resist	dimethylpolysiloxane Si Si3N4 SiO₂ SiON Various polymers PI