Flexible

The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.

The following is a list of equipment that fall into the "Flexible" category.

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Notes
Wet Bench Flexible Solvents 1 wbflexsolv-1	Wet Bench Flexible Solvents 1 and 2 Training	Flexible	SNF Cleanroom Paul G Allen L107	Manual solvent cleaning, two ultrasonic baths.
MVD mvd	MVD Training	Flexible	SNF Cleanroom Paul G Allen L107	Reactor located inside glovebox
Wet Bench Flexible Solvents 2 wbflexsolv-2	Wet Bench Flexible Solvents 1 and 2 Training	Flexible	SNF Cleanroom Paul G Allen L107	Manual solvent cleaning, hot plate
Savannah ALD savannah	ALD Savannah Training	Flexible	SNF Cleanroom Paul G Allen L107
Wet Bench Solvent Lithography lithosolv	Lithography Solvent Bench Training	Flexible	SNF Cleanroom Paul G Allen L107	Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Technics Asher technics	Technics Asher Training	Flexible	SNF Cleanroom Paul G Allen L107
Wet Bench Flexcorr 3 wbflexcorr-3	Wet Bench Flexcorr 1and2 and 3and4 Training	Flexible	SNF Cleanroom Paul G Allen L107	Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
EVG Wafer Bonder evbond	Wafer Bonder EVG Training	Flexible	SNF Cleanroom Paul G Allen L107
Samco PC300 Plasma Etch System samco	Samco Training	Flexible	SNF Cleanroom Paul G Allen L107
Oxford III-V etcher Ox-35	Oxford III-V etcher Training	Flexible	SNF Cleanroom Paul G Allen L107	Metal etching or Metal hard masks are not allowed. 4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only.
Wet Bench Flexible Solvents wbflexsolv	Wet Bench Flexible Solvents 1 and 2 Training	Flexible	SNF Cleanroom Paul G Allen L107	Manual solvent cleaning of substrates or resist removal.
Critical Point Dryer Tousimis Automegasamdri-915B cpd	Critical Point Dryer Training	Flexible	SNF Cleanroom Paul G Allen L107	CO2 drying after release of micromachined devices
Tystar Bank 1 Tube 2 B1T2 Flexible Oxide Anneal	Tystar Atmospheric Tube Training	Flexible	SNF Cleanroom Paul G Allen L107
MRC Reactive Ion Etcher mrc	MRC Reactive Ion Etcher Training	Flexible	SNF Cleanroom Paul G Allen L107	Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode
Tystar Bank 1 Tube 1 B1T1 Flexible Oxide	Tystar Atmospheric Tube Training	Flexible	SNF Cleanroom Paul G Allen L107
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL	Plasma Therm Versaline LL ICP Metal Etcher Training	Flexible	SNF Cleanroom Paul G Allen L107	Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)
Matrix Plasma Resist Strip matrix	Matrix Plasma Resist Strip Training	Flexible	SNF Cleanroom Paul G Allen L107	Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
Alveole Primo alveole	Protein patterning Alveole Primo Training	Flexible	SNF Exfab Paul G Allen 151 Ocean
Jasco UV-Vis-NIR jasco-uv-vis-nir	Jasco UV-Vis-NIR Training	Flexible	SNF Exfab Paul G Allen 151 Ocean
Sinton Lifetime Tester sinton-lifetime-tester	Sinton Lifetime Tester Training	Flexible	SNF Exfab Paul G Allen 151 Ocean

Pages

Equipment name & NEMO ID	Technique	Cleanliness	Primary Materials Etched	Other Materials Etched	Material Thickness Range	Materials Lab Supplied	Materials User Supplied	Process Temperature Range	Gases	Accessories Available	Substrate Size	Substrate Type	Maximum Load
Formlabs Form2 3D Printer form2-3d-printer	3D Printing	Flexible											Multiple parts - depending on the final part size
Fujifilm Dimatix Ink Jet Printer nanoinkjet	Deposition > Ink	Flexible				PROM Approval Required for Materials
Fumehood 1 fumehood1	Controlled Environment	Flexible
Fumehood 2 fumehood2	Controlled Environment	Flexible
Fumehood 3 fumehood3	Controlled Environment	Flexible
Fumehood 4 fumehood4	Controlled Environment	Flexible
Glovebox-l glovebox-l	Controlled Environment	Flexible
Glovebox-r glovebox-r	Controlled Environment Material Transfer	Flexible				Various 2D Materials			N₂
Hummer V Sputter Coater hummer	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible
Ika T18 Disperser disperser	Sonication	Flexible
Jasco UV-Vis-NIR jasco-uv-vis-nir	Characterization	Flexible
Lesker Sputter lesker-sputter	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible				Ag Al AlSi Au Co Cr Cu Fe Nb Ni Pd Si SiO₂ Ta Ti TiN W Alumina ITO	CoFeB Ge Hf In₂O₃ LaB₆ Ru Sc Sn TiN WO₃ ZnO₃ ZrY GST Hafnia Moly Ti Tungsten				Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1 4 inch wafer, 1 6 inch wafer
Malvern Dynamic Light Scattering (DLS) Zetasizer malvern-dls	Characterization > Dynamic Light Scattering	Flexible								Integrating Sphere	Pieces Other
Matrix Plasma Resist Strip matrix	Etching > Dry Etching > Downstream/Remote Plasma Etching Cleaning > Resist Removal > Dry Resist Removal > Downstream/Remote Plasma Resist Removal	Flexible	Resist	PI					O₂		4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	25
Minitech-GX Micromill micromill	Machining > Micromilling	Flexible
MRC Reactive Ion Etcher mrc	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	Metals Various Dielectrics	Metal oxides PI					Ar CHClF₂ CHF₃ O₂ SF₆		Pieces 2" 3" 4" 6"		1
MVD mvd	Deposition > Atomic Layer Deposition (ALD) > Thermal ALD	Flexible			1.00 Å - 50.00 nm	C₉H₂₃NO₃Si Various Dielectrics Alumina DETA Hafnia ODS SAMS		24 °C - 150 °C	Ar		Pieces 2" 3" 4" 6" 8"
Nanoscribe Photonics GT nanoscribe	3D Printing Patterning	Flexible											1
Optomec Printer optomec-printer	Deposition > Ink	Flexible									Pieces 2" 3" 4" 6"
Oriel Deep UV Exposure Lamp oriel-duv	Other	Flexible