Wet Chemical Processing

Technique Tabs

Main Tab

Processing Techniques	Equipment name & NEMO ID	Teaser Blurb	Cleanliness	Location
CO2 Drying, Wet Chemical Processing	Critical Point Dryer Tousimis Automegasamdri-936 cpd	Critical Point Drying (CPD) tool is used for carbon dioxide (CO2) drying after release of bulk or surface micromachined devices.	Flexible	SNF Cleanroom Paul G Allen L107
Resist Develop (manual), Wet Chemical Processing	Ex Fab Develop Wet Bench wbexfab_dev	Manual developing of photoresist using mainly MF-26A.	Flexible	SNF Exfab Paul G Allen 104 Stinson
Solvent Cleaning, Metal Lift-off, Wet Chemical Processing	Ex Fab Solvent Wet Bench wbexfab_solv		Flexible	SNF Exfab Paul G Allen 104 Stinson
Mask Cleaning (manual), Wet Chemical Processing	Mask Scrubber masksrub	Manual mask cleaner for one 5 inch mask, water under pressure.	All	SNF Cleanroom Paul G Allen L107
Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing	Wet Bench Clean 1 wbclean-1	Wet Bench Clean-1 and 2 is used for RCA cleaning 3", 4", and 6" silicon, silicon germanium, or quartz wafers which are in the 'clean' cleanliness group.	Clean	SNF Cleanroom Paul G Allen L107
Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing	Wet Bench Clean 2 wbclean-2	Wet Bench Clean-1 and 2 is used for RCA cleaning 3", 4", and 6" silicon, silicon germanium, or quartz wafers which are in the 'clean' cleanliness group.	Clean	SNF Cleanroom Paul G Allen L107
Silicon Nitride Wet Etching, Wet Chemical Processing	Wet Bench Clean_res- hotphos wbclean_res-hotphos	Semi-automated wet bench for etching silicon nitride from 3", 4", and 6" Si, SiGe, and quartz substrates using 155C phosphoric acid. The baths can hold up to 25 wafers. Part of the Clean Cleanliness Group.	Clean	SNF Cleanroom Paul G Allen L107
Silicon Oxide Wet Etching, Wet Chemical Processing	Wet Bench Clean_res-hf wbclean_res-hf	Semi-automated wet bench for etching oxide from 3", 4", and 6" Si, SiGe, and quartz substrates using 50:1 HF, 6:1BOE, or 20:1BOE. 2 baths can hold up to 25 wafers. Part of the Clean Cleanliness Group.	Clean	SNF Cleanroom Paul G Allen L107
Piranha Cleaning, Wet Resist Removal, Wet Chemical Processing	Wet Bench Clean_res-piranha wbclean_res-piranha	Wet Bench Clean_res-piranha is part of the 'clean' cleanliness group and is used to clean or remove resist from 3", 4", and 6" silicon, quartz, and silicon germanium wafers using piranha. 2 baths are available and can hold up to 25 wafers.	Clean	SNF Cleanroom Paul G Allen L107
Aluminum and Titanium and Tungsten Wet Etching, Wet Chemical Processing	Wet Bench CMOS Metal wbclean3	Wet bench part of semiclean cleanliness group to etch Al, Ti, W, or silicon oxide from 3, 4, or 6 inch wafers. The tanks can hold up to 25 wafers.	Semiclean	SNF Cleanroom Paul G Allen L107
Decontamination, Wet Chemical Processing	Wet Bench Decontamination wbdecon	Decontamination of 3" or 4" silicon, quartz, or silicon germanium wafers after KOH, wafersaw, or cmp using SC2 before being allowed back into the clean equipment group.	Clean	SNF Cleanroom Paul G Allen L107
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing	Wet Bench Flexcorr 1 wbflexcorr-1	Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot plate available. GaAs allowed in personal labware only.	Flexible	SNF Cleanroom Paul G Allen L107
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing	Wet Bench Flexcorr 2 wbflexcorr-2	Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot pots available. GaAs allowed in personal labware only.	Flexible	SNF Cleanroom Paul G Allen L107
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing	Wet Bench Flexcorr 3 wbflexcorr-3	Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.	Flexible	SNF Cleanroom Paul G Allen L107
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing	Wet Bench Flexcorr 4 wbflexcorr-4	Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.	Flexible	SNF Cleanroom Paul G Allen L107
Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing	Wet Bench Flexible Solvents 1 wbflexsolv-1	Manual solvent cleaning, two ultrasonic baths.	Flexible	SNF Cleanroom Paul G Allen L107
Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing	Wet Bench Flexible Solvents 2 wbflexsolv-2	Manual solvent cleaning and resist removal, hot plate.	Flexible	SNF Cleanroom Paul G Allen L107
Resist Develop (manual), Wet Chemical Processing	Wet Bench Miscellaneous wbmiscres	Manual developing of photoresist using mainly AZ1:1 developer.	Flexible	SNF Cleanroom Paul G Allen L107
Wet Resist Removal, Wet Chemical Processing	Wet Bench Resist Strip wbresstrip-1	Wet bench to remove resist using SRS-100 or PRS1000.	Clean (Ge), Semiclean, Flexible	SNF Cleanroom Paul G Allen L107
Solvent Cleaning, Wet Chemical Processing	Wet Bench Solvent Lithography lithosolv	Manual solvent cleaning of materials in the flexible cleanliness group. Teflon coated metal tweezers cleaning. SU8 development.	Flexible	SNF Cleanroom Paul G Allen L107

Detail Tab

Processing Technique	Equipment name & NEMO ID	Cleanliness	Chemicals	Primary Materials Etched	Other Materials Etched	Substrate Size	Maximum Load (number of wafers)	Process Temperature Range	Developer	Mask Size	Notes
CO2 Drying, Wet Chemical Processing	Critical Point Dryer Tousimis Automegasamdri-936 cpd	Flexible	CO₂			Pieces 2" 3" 4" 6"					CO2 drying after release of micromachined devices
Resist Develop (manual), Wet Chemical Processing	Ex Fab Develop Wet Bench wbexfab_dev	Flexible				Pieces 2" 3" 4" 6" 8" 12" Other			AZ 1:1 MF-26A developer		Manual development of resist in beakers. SNF approved developers only. No solvents!
Solvent Cleaning, Metal Lift-off, Wet Chemical Processing	Ex Fab Solvent Wet Bench wbexfab_solv	Flexible	Solvents			Pieces 2" 3" 4" 6" 8" Other
Mask Cleaning (manual), Wet Chemical Processing	Mask Scrubber masksrub	All	DI Water							5 inch	5 inch mask cleaning, water under pressure, no chemicals
Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing	Wet Bench Clean 1 wbclean-1	Clean	50:1 HF SC1 SC2			3" 4" 6"	25				No resist allowed. Resist should have been removed at the wbclean_res-piranha.
Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing	Wet Bench Clean 2 wbclean-2	Clean	50:1 HF 6:1 BOE SC1 SC2			3" 4" 6"	25				No resist allowed. Resist should have been removed at the wbclean_res-piranha
Silicon Nitride Wet Etching, Wet Chemical Processing	Wet Bench Clean_res- hotphos wbclean_res-hotphos	Clean		Si3N4		3" 4" 6"					Resist should have been removed
Silicon Oxide Wet Etching, Wet Chemical Processing	Wet Bench Clean_res-hf wbclean_res-hf	Clean	20:1 BOE 50:1 HF 6:1 BOE	SiO₂		3" 4" 6"					Resist as mask allowed
Piranha Cleaning, Wet Resist Removal, Wet Chemical Processing	Wet Bench Clean_res-piranha wbclean_res-piranha	Clean	9:1 Piranha			3" 4" 6"					Resist will be removed
Aluminum and Titanium and Tungsten Wet Etching, Wet Chemical Processing	Wet Bench CMOS Metal wbclean3	Semiclean	20:1 BOE 50:1 HF 6:1 BOE Al-Etch Ti-Etch W-etch	Al Ti W		3" 4" 6"	25 wafers				Al, Ti, or W wet etching or oxide etching
Decontamination, Wet Chemical Processing	Wet Bench Decontamination wbdecon	Clean	SC2			3" 4" 6"					KOH or wafersaw or post-cmp decontamination
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing	Wet Bench Flexcorr 1 wbflexcorr-1	Flexible	Acids Bases Gold Etchant 20:1 BOE 50:1 HF 6:1 BOE 9:1 Piranha Al-Etch Chrome Etch KOH SC1 SC2	Metals Al Au Cr Si SiO₂ Resist	GaAs Si3N4 Ti W	Pieces 2" 3" 4" 6"					Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing	Wet Bench Flexcorr 2 wbflexcorr-2	Flexible	Acids Bases			Pieces 2" 3" 4" 6"					Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing	Wet Bench Flexcorr 3 wbflexcorr-3	Flexible	Acids Bases			Pieces 2" 3" 4" 6"					Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing	Wet Bench Flexcorr 4 wbflexcorr-4	Flexible	Acids Bases			Pieces 2" 3" 4" 6"					Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.
Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing	Wet Bench Flexible Solvents 1 wbflexsolv-1	Flexible	Solvents			Pieces 2" 3" 4" 6"					Manual solvent cleaning, two ultrasonic baths.
Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing	Wet Bench Flexible Solvents 2 wbflexsolv-2	Flexible	Solvents			Pieces 2" 3" 4" 6"					Manual solvent cleaning, hot plate
Resist Develop (manual), Wet Chemical Processing	Wet Bench Miscellaneous wbmiscres	Flexible	Developers			Pieces 2" 3" 4" 6"			AZ 1:1		Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Wet Resist Removal, Wet Chemical Processing	Wet Bench Resist Strip wbresstrip-1	Clean (Ge), Semiclean, Flexible	PRS-1000 SRS-100	Resist		Pieces 2" 3" 4"	25 4 inch wafers	20 °C - 60 °C			Wet Resist Removal: SRS-100 or PRS1000
Solvent Cleaning, Wet Chemical Processing	Wet Bench Solvent Lithography lithosolv	Flexible	Solvents			Pieces 2" 3" 4" 6"					Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.