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Titanium NItride
Chemical Formula:
TiN
Equipment Tabs
Deposition Equipment
Equipment name or Badger ID
Partial words okay.
Deposition Equipment
Equipment name & Badger ID
Cleanliness
Location
Material Thickness Range
Approved Materials supplied by Lab
Fiji 1 ALD
fiji1
Semiclean
SNF Cleanroom Paul G Allen L107
1.00 Å
-
50.00 nm
Metal oxides
Al
2
O
3
HfN
HfO
2
Pt
Ru
SiO
2
Ta
2
O
5
TaN
TiN
TiO
2
Various Dielectrics
ZrO
2
Fiji 2 ALD
fiji2
Flexible
SNF Cleanroom Paul G Allen L107
1.00 Å
-
50.00 nm
Metal oxides
Al
2
O
3
Ga
2
O
3
HfN
HfO
2
In
2
O
3
In
x
Sn
y
O
z
MoO
3
Ni
x
O
y
Pt
Ru
Si3N4
SiO
2
SnO
2
SrO
Ta
2
O
5
TiN
TiO
2
Various Dielectrics
ZrO
2
Lesker Sputter
lesker-sputter
Flexible
SNF Exfab Paul G Allen 155A Venice
Ag
Al
Al
2
O
3
AlSi
Au
Co
Cr
Cu
Fe
In
x
Sn
y
O
z
Nb
Ni
Pd
Si
SiO
2
Ta
Ti
TiN
W
Lesker2 Sputter
lesker2-sputter
Semiclean
SNF Cleanroom Paul G Allen L107
1.00 μm
Ag
Al
Al
2
O
3
AlSi
Cr
Ge
In
x
Sn
y
O
z
Mo
Pd
Ru
Sc
Si
SiO
2
Sn
Ta
Ti
TiN
W
Projects
Au-Sn Eutectic chip-bonding for high heat flux vapor chamber applications using Flip Chip Bonder: Suggestions and Tips
-- (Nano Nugget)
Lesker2 Sputter TiN Initial Development
-- (Nano Nugget)
TiN Characterization- Final Report
-- (Report)
ALD TiN- Final Presentation
-- (Presentation)
ALD Process for Top-Gating 2D Materials
