During integrated processing, cleaning steps are often inserted to remove un-needed resist, post-etch residues and particles, or to prepare a surface for a following process. The various tools listed here perform both dry and wet cleaning. The cleaning method you will need will depend on the materials you would like to remove as well as the contamination category of your sample. (For more about the contamination categories, please visit the Cleanliness (previously Contamination) Groups page).
| Processing Techniques | Equipment name & NEMO ID | Teaser Blurb | Cleanliness | Location |
|---|---|---|---|---|
| Solvent Cleaning, Metal Lift-off, Wet Chemical Processing |
Ex Fab Solvent Wet Bench wbexfab_solv |
Flexible | SNF Exfab Paul G Allen 104 Stinson | |
| Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching |
Gasonics Aura Asher gasonics |
The Gasonics Aura Asher is an automated down stream microwave plasma system used for stripping photoresist of 4 inch wafers in the 'clean' cleanliness group. |
Clean, Semiclean | SNF Paul G Allen L107 Cleanroom |
| Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching |
Matrix Plasma Resist Strip matrix |
The Matrix plasma asher is used to strip photoresist from contaminated wafers using a combination of oxygen plasma, high power, higher pressure and a heated chuck (platen). |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Plasma Mode Etching, Reactive Ion Etching (RIE), Downstream/Remote Plasma Resist Removal |
Samco PC300 Plasma Etch System samco |
The SAMCO etcher is a multifunctional etcher that can operate in either the RIE, plasma etch or Downstream plasma modes |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Dry Resist Removal, Dry Etching |
Technics Asher technics |
Technics PE II-A is used for descum, resist strip and surface treatment with O2 plasma |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing |
Wet Bench Clean 1 wbclean-1 |
Wet Bench Clean-1 and 2 is used for RCA cleaning 3", 4", and 6" silicon, silicon germanium, or quartz wafers which are in the 'clean' cleanliness group. |
Clean | SNF Paul G Allen L107 Cleanroom |
| Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing |
Wet Bench Clean 2 wbclean-2 |
Wet Bench Clean-1 and 2 is used for RCA cleaning 3", 4", and 6" silicon, silicon germanium, or quartz wafers which are in the 'clean' cleanliness group. |
Clean | SNF Paul G Allen L107 Cleanroom |
| Piranha Cleaning, Wet Resist Removal, Wet Chemical Processing |
Wet Bench Clean_res-piranha wbclean_res-piranha |
Wet Bench Clean_res-piranha is part of the 'clean' cleanliness group and is used to clean or remove resist from 3", 4", and 6" silicon, quartz, and silicon germanium wafers using piranha. 2 baths are available and can hold up to 25 wafers. |
Clean | SNF Paul G Allen L107 Cleanroom |
| Decontamination, Wet Chemical Processing |
Wet Bench Decontamination wbdecon |
Decontamination of 3" or 4" silicon, quartz, or silicon germanium wafers after KOH, wafersaw, or cmp using SC2 before being allowed back into the clean equipment group. |
Clean | SNF Paul G Allen L107 Cleanroom |
| Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing |
Wet Bench Flexcorr 1 wbflexcorr-1 |
Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot plate available. GaAs allowed in personal labware only. |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing |
Wet Bench Flexcorr 2 wbflexcorr-2 |
Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot pots available. GaAs allowed in personal labware only. |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing |
Wet Bench Flexcorr 3 wbflexcorr-3 |
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed. |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing |
Wet Bench Flexcorr 4 wbflexcorr-4 |
Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed. |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Solvent Cleaning, Wet Resist Removal, Metal Lift-off |
Wet Bench Flexible Solvents wbflexsolv |
Manual solvent cleaning of materials in the flexible cleanliness group. |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing |
Wet Bench Flexible Solvents 1 wbflexsolv-1 |
Manual solvent cleaning, two ultrasonic baths. |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing |
Wet Bench Flexible Solvents 2 wbflexsolv-2 |
Manual solvent cleaning and resist removal, hot plate. |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Wet Resist Removal, Wet Chemical Processing |
Wet Bench Resist Strip wbresstrip-1 |
Wet bench to remove resist using SRS-100 or PRS1000. |
Clean (Ge), Semiclean, Flexible | SNF Paul G Allen L107 Cleanroom |
| Solvent Cleaning, Wet Chemical Processing |
Wet Bench Solvent Lithography lithosolv |
Manual solvent cleaning of materials in the flexible cleanliness group. Teflon coated metal tweezers cleaning. SU8 development. |
Flexible | SNF Paul G Allen L107 Cleanroom |