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Stanford Nanofabrication Facility
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Tin
Chemical Formula:
Sn
Equipment Tabs
Deposition Equipment
Equipment name or Badger ID
Partial words okay.
Deposition Equipment
Equipment name & Badger ID
Cleanliness
Location
Material Thickness Range
Approved Materials supplied by Lab
Lesker Sputter
lesker-sputter
Flexible
SNF Exfab Paul G Allen 155A Venice
Ag
Al
Al
2
O
3
AlSi
Au
Co
Cr
Cu
Fe
In
x
Sn
y
O
z
Nb
Ni
Pd
Si
SiO
2
Ta
Ti
TiN
W
Lesker2 Sputter
lesker2-sputter
Semiclean
SNF Cleanroom Paul G Allen L107
1.00 μm
Ag
Al
Al
2
O
3
AlSi
Cr
Ge
In
x
Sn
y
O
z
Mo
Pd
Ru
Sc
Si
SiO
2
Sn
Ta
Ti
TiN
W
Projects
Au-Sn Eutectic chip-bonding for high heat flux vapor chamber applications using Flip Chip Bonder: Suggestions and Tips
-- (Nano Nugget)