ExFab: 155A Venice

Following is a list of tools located in this lab space (room).

Equipment Tables

Equipment name & NEMO ID	Technique	Cleanliness	Primary Materials Etched	Material Thickness Range	Materials Lab Supplied	Materials User Supplied	Gases	Substrate Size	Substrate Type	Maximum Load
AJA Evaporator aja-evap	Deposition > Physical Vapor Deposition (PVD) > Evaporation	Flexible		0.00 - 300.00 nm	Ag Al Au Co Cr Cu Fe Ge Hf Ni Ni_xO_y Pd Pt SiO₂ Ti Titania			Pieces 2" 3" 4" 6"	Silicon (Si) Silicon Germanium (SiGe) Quartz (SiO2) Sapphire (Al₂O₃) Glass (SiO₂) Germanium (Ge) Silicon Carbide (SiC) Gallium Nitride (GaN) III-V (III-V) Gallium Arsenide (GaAs) Polymer (Various) Other (ProMCom approval required) (Various)	4"x3 or 6"x1 wafers or pieces
Epilog Fusion M2 Laser Cutter lasercutter	Machining > Laser Cutting	Flexible
Lesker Sputter lesker-sputter	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible			Ag Al AlSi Au Co Cr Cu Fe Nb Ni Pd Si SiO₂ Ta Ti TiN W Alumina ITO	CoFeB Ge Hf In₂O₃ LaB₆ Ru Sc Sn TiN WO₃ ZnO₃ ZrY GST Hafnia Moly Ti Tungsten		Pieces 2" 3" 4" 6"	Silicon (Si) Silicon Germanium (SiGe) Quartz (SiO2) Sapphire (Al₂O₃) Glass (SiO₂) Germanium (Ge) Silicon Carbide (SiC) Gallium Nitride (GaN) III-V (III-V) Gallium Arsenide (GaAs)	1 4 inch wafer, 1 6 inch wafer
Minitech-GX Micromill micromill	Machining > Micromilling	Flexible
Optomec Printer optomec-printer	Deposition > Ink	Flexible						Pieces 2" 3" 4" 6"
Plasmaetch PE-50 plasma-etch	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	Resist				78% N₂, 21% O₂, ~1% Ar	Pieces 2" 3" 4" 6"		Multiple