Wet etching refers to processes that use liquid chemicals to remove materials from samples. Important considerations for wet etching processes are the isotropic nature of the etch and it's impact to your desired pattern, the selectivity (ratio of etch rates between materials you want to remove and other materials that will be exposed to the etchant), and chemical safety. When selecting which equipment to use, you will need to consider the type of chemical, the size and shape of your sample, and the Cleanliness (formerly known as Contamination) group.
| Processing Technique | Equipment name & NEMO ID | Cleanliness | Chemicals | Primary Materials Etched | Other Materials Etched | Substrate Size | Maximum Load (number of wafers) | Notes | Stylus Tip Radius |
|---|---|---|---|---|---|---|---|---|---|
| Silicon Nitride Wet Etching, Wet Chemical Processing |
Wet Bench Clean_res- hotphos wbclean_res-hotphos |
Clean |
Resist should have been removed |
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| Silicon Oxide Wet Etching, Wet Chemical Processing |
Wet Bench Clean_res-hf wbclean_res-hf |
Clean |
Resist as mask allowed |
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| Aluminum and Titanium and Tungsten Wet Etching, Wet Chemical Processing |
Wet Bench CMOS Metal wbclean3 |
Semiclean | 25 wafers |
Al, Ti, or W wet etching or oxide etching |
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| Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing |
Wet Bench Flexcorr 1 wbflexcorr-1 |
Flexible |
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only. |
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| Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing |
Wet Bench Flexcorr 2 wbflexcorr-2 |
Flexible |
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only |
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| Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing |
Wet Bench Flexcorr 3 wbflexcorr-3 |
Flexible |
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed. |
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| Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing |
Wet Bench Flexcorr 4 wbflexcorr-4 |
Flexible |
Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed. |