Dry etching refers to the processes that use energetic gaseous species produced by a plasma to remove material. In order to modulate and control the etching conditions and characteristics, different types of plasma sources are utilized in the dry etching process and the equipment are categorized accordingly.

If you would like to learn about different types of dry etchers and how to chose your etcher, please visit the online dry etching course.

If you would like to see a summary of etchers for a specific material (i.e. SiO2 or poly silicon) please visit the materials page.

 

Processing Techniques Equipment name & NEMO ID Teaser Blurb Cleanliness Location
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching Gasonics Aura Asher
gasonics

The Gasonics Aura Asher is an automated down stream microwave plasma system used for stripping photoresist of 4 inch wafers in the 'clean' cleanliness group.

Clean, Semiclean SNF Paul G Allen L107 Cleanroom
Inductively Coupled Plasma Etching (ICP) Lam Research TCP 9400 Poly Etcher
lampoly

Lam 9400 TCP Poly Etcher ; Clean category; for poly and Si etches; maximum etch depth 3um.

Clean, Semiclean SNF Paul G Allen L107 Cleanroom
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching Matrix Plasma Resist Strip
matrix

The Matrix plasma asher is used to strip photoresist from contaminated wafers using a combination of oxygen plasma, high power, higher pressure and a heated chuck (platen).

Flexible SNF Paul G Allen L107 Cleanroom
Reactive Ion Etching (RIE) MRC Reactive Ion Etcher
mrc

The MRC is a general purpose, plasma reactive ion etching system, used to etch a variety of materials, including metals, oxides, nitrides, silicons, and some organic films.

Flexible SNF Paul G Allen L107 Cleanroom
Reactive Ion Etching (RIE) Oxford Dielectric Etcher
oxford-rie

Oxford-rie is to etch di-electric materials with fluorine based etch gases and oxygen.

Flexible SNF Paul G Allen L107 Cleanroom
Inductively Coupled Plasma Etching (ICP) Oxford III-V etcher
Ox-35

Ox-35 is an ICP-RIE etch system configured for the etching of III-V materils and Si.

Flexible SNF Paul G Allen L107 Cleanroom
Inductively Coupled Plasma Etching (ICP) Oxford Plasma Pro ICP-RIE
Ox-gen
Flexible SNF Paul G Allen L107 Cleanroom
Inductively Coupled Plasma Etching (ICP) Oxford Plasma Pro ICP-RIE ALE
Ox-ALE

Oxford ICP-RIE Atomic Layer Etching (OX-ALE) is an Inductively Coupled Plasma (ICP) etch system designed for high-precision etching of silicon-based materials, III-V semiconductors, and 2D materials.

Flexible SNF Paul G Allen L107 Cleanroom
Inductively Coupled Plasma Etching (ICP) Oxford Plasma Pro ICP-RIE Ox
Ox-Ox

Oxford ICP-RIE Oxide Etcher (Ox-Ox) is an Inductively Coupled Plasma (ICP) etch system optimized for high-precision etching of silicon-based materials

Clean SNF Paul G Allen L107 Cleanroom
Inductively Coupled Plasma Etching (ICP) Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE

PT-DSE is an Deep Si etches using alternate gas technique similar to Bosch process.

Flexible SNF Paul G Allen L107 Cleanroom
Inductively Coupled Plasma Etching (ICP) Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox

PT-MTL is an ICP-RIE etch system configured for the etching of silicon oxide and deep glass/quartz etching.

Flexible SNF Paul G Allen L107 Cleanroom
Inductively Coupled Plasma Etching (ICP) Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL

PT-MTL is an ICP-RIE etch system configured for the etching of metals and metal-based compounds with volatile bi-products

Flexible SNF Paul G Allen L107 Cleanroom
Reactive Ion Etching (RIE) Plasmaetch PE-50
plasma-etch

The Plasmaetch PE-50 is located in Venice, and is used primarily for surface treatment, for example with PDMS.

Flexible SNF Exfab Paul G Allen 155A Venice
Plasma Mode Etching, Reactive Ion Etching (RIE), Downstream/Remote Plasma Resist Removal Samco PC300 Plasma Etch System
samco

The SAMCO etcher is a multifunctional etcher that can operate in either the RIE, plasma etch or Downstream plasma modes

Flexible SNF Paul G Allen L107 Cleanroom
Dry Resist Removal, Dry Etching Technics Asher
technics

Technics PE II-A is used for descum, resist strip and surface treatment with O2 plasma

Flexible SNF Paul G Allen L107 Cleanroom