This is an archive of requests from 2013 to 2021. New requests are not being added here.
| PROM Request Title | PROM Date | PROM Request Summary | Equipment List | PROM Decision |
|---|---|---|---|---|
| Processing of DNA films in SNF | 04/17/2019 (all day) | DNA films (made elsewhere) to be used in SNF equipment. | Request approved. Please see process staff for details. | |
| Custom CMP pad for SiC polishing | 04/15/2019 (all day) | Request to test new pad material for CMP in order to enable silicon carbide CMP. | CMP GnP POLI-400L (cmp) | Approved. |
| EIM-TFSI/p(VDF-HFP) Ion gel processing | 04/11/2019 (all day) | Introduction of new gel material (made elsewhere) into SNF process equipment for patterning and deposition. |
AJA Evaporator (aja-evap), SVG Resist Coat Track 1 (svgcoat), Heidelberg MLA 150 (heidelberg) |
Approved. |
| Use and Storage of Copper Electroplating Solution in Room 155 | 04/10/2019 (all day) | Copper electroplating to be done in Fumehood1 in ExFab Room 155. | Fumehood 1 (fumehood1) | Approved. |
| Use of HD Microsystems HD-8930, PI-2610, PI-2545 polyimide precursors and VM-651 adhesion promoter | 04/04/2019 (all day) | Request to bring chemicals into the SNF. | Request approved. Please see process staff for details. | |
| Use and Storage of PI-2611 in SNF | 04/02/2019 (all day) | Request to use PI on Heidelberg | Heidelberg MLA 150 (heidelberg) | Approved. |
| Vanadium Dioxide Anneal and Patterning | 04/02/2019 (all day) | Request to anneal and pattern VO2 from an outside source in the SNF. | Heidelberg MLA 150 (heidelberg) | Approved. |
| ZnO film development using DMZ and Ozone on MVD | 04/01/2019 (all day) | Request to use new DMZ precursor on the MVD with Ozone for ZnO film development. |
MVD (mvd), Savannah ALD (savannah) |
Request approved. Please see process staff for details. |
| Orthogonal lithography of organic thin films | 03/28/2019 (all day) | Request to use Orthogonal photoresist in SNF |
Headway Manual Resist Spinner (headway2), Heidelberg MLA 150 (heidelberg), Wet Bench Solvent Lithography (lithosolv) |
No appropriate spin coater in SNF, user found capability at SNSF |
| N2 Annealing in clean Thermco | 03/19/2019 (all day) | Request to bring wafers from outside the cleanroom directly into clean Thermco tool. Documentation provided demonstrating VPD ICPMS results of clean lab. | Request approved. Please see process staff for details. |