PROM Request Title | PROM Date | PROM Request Summary | Equipment List | PROM Decision |
---|---|---|---|---|
Use of HD Microsystems HD-8930, PI-2610, PI-2545 polyimide precursors and VM-651 adhesion promoter | 04/04/2019 | Request to bring chemicals into the SNF. | Request approved. Please see process staff for details. | |
Use and Storage of PI-2611 in SNF | 04/02/2019 | Request to use PI on Heidelberg | Heidelberg MLA 150 (heidelberg) | Approved. |
Vanadium Dioxide Anneal and Patterning | 04/02/2019 | Request to anneal and pattern VO2 from an outside source in the SNF. | Heidelberg MLA 150 (heidelberg) | Approved. |
ZnO film development using DMZ and Ozone on MVD | 04/01/2019 | Request to use new DMZ precursor on the MVD with Ozone for ZnO film development. |
MVD (mvd), Savannah ALD (savannah) |
Request approved. Please see process staff for details. |
Orthogonal lithography of organic thin films | 03/28/2019 | Request to use Orthogonal photoresist in SNF |
Headway Manual Resist Spinner (headway2), Heidelberg MLA 150 (heidelberg), Wet Bench Solvent Lithography (lithosolv) |
No appropriate spin coater in SNF, user found capability at SNSF |
N2 Annealing in clean Thermco | 03/19/2019 | Request to bring wafers from outside the cleanroom directly into clean Thermco tool. Documentation provided demonstrating VPD ICPMS results of clean lab. | Request approved. Please see process staff for details. | |
Chemical Usage Request for Room 155 | 03/15/2019 | Request to bring in Ethylene Chloride, Tetrahydrofuran, and Diethylene Chloride into Room 155. | Fumehood 1 (fumehood1) | DCE is not approved, others are. Please see process staff for details. |
Adhesion Promoter for Nanoscribe IP Resists | 03/13/2019 | Request to bring 3-(Trimethoxysilyl)propyl methacrylate in as adhesion promoter for Nanoscribe. |
Nanoscribe Photonics GT (nanoscribe), Wet Bench Flexcorr 3 (wbflexcorr-3) |
Request approved. Please see process staff for details. |
InSb Target for Lesker Sputter | 02/26/2019 | Request to use InSb target in high temperature sputter deposition using the Lesker Sputter. | Lesker Sputter (lesker-sputter) | NOT Approved. Since the tool is shared by many users who are operating all over the available temperature ranges, there are significant risks for the Sb left in the chamber after your run to migrate both into other's samples as well into areas of ... |
TiN in Fiji3 | 02/26/2019 | Request to run conductive films on Fiji3, which is outside the current use case to evaluate impact of turbo pump on O and C content of ALD nitride films. Films will be buried in SiO2 to prevent contamination for next users. | Fiji 3 ALD (fiji3) | Approved. |