This is an archive of requests from 2013 to 2021. New requests are not being added here.
| PROM Request Title | PROM Date | PROM Request Summary | Equipment List | PROM Decision |
|---|---|---|---|---|
| Chemical Usage Request for Room 155 | 03/15/2019 (all day) | Request to bring in Ethylene Chloride, Tetrahydrofuran, and Diethylene Chloride into Room 155. | Fumehood 1 (fumehood1) | DCE is not approved, others are. Please see process staff for details. |
| Adhesion Promoter for Nanoscribe IP Resists | 03/13/2019 (all day) | Request to bring 3-(Trimethoxysilyl)propyl methacrylate in as adhesion promoter for Nanoscribe. |
Nanoscribe Photonics GT (nanoscribe), Wet Bench Flexcorr 3 (wbflexcorr-3) |
Request approved. Please see process staff for details. |
| TiN in Fiji3 | 02/26/2019 (all day) | Request to run conductive films on Fiji3, which is outside the current use case to evaluate impact of turbo pump on O and C content of ALD nitride films. Films will be buried in SiO2 to prevent contamination for next users. | Fiji 3 ALD (fiji3) | Approved. |
| InSb Target for Lesker Sputter | 02/26/2019 (all day) | Request to use InSb target in high temperature sputter deposition using the Lesker Sputter. | Lesker Sputter (lesker-sputter) | NOT Approved. Since the tool is shared by many users who are operating all over the available temperature ranges, there are significant risks for the Sb left in the chamber after your run to migrate both into other's samples as well into areas of ... |
| Potassium Dichromate 0.15M solution for defect etching | 02/25/2019 (all day) | Request to make chemical mixture using powder in Room 155, then bring solution into cleanroom for etching at wbflexcorr. | Wet Bench Flexcorr 1 (wbflexcorr-1) | Approved. |
| Zr ICP Standard use in SNF | 02/21/2019 (all day) | Bring in small vial of Zr ICP standard for use in SNF. | Request approved. Please see process staff for details. | |
| Wafer scribe and etch procedure to go into clean etch tools | 02/19/2019 (all day) | Introduce jig and create process flow to dice a wafer into pieces and be allowed into clean etch tools without addtional cleans. | Epilog Fusion M2 Laser Cutter (lasercutter) | Approved. |
| Developing Backside Alignment with chips on Heidelberg | 02/14/2019 (all day) | Introduce jig for creating backside alignment procedure for Heidelberg. | Heidelberg MLA 150 (heidelberg) | Approved. |
| U2OS cells on nanostructure for Critical Point Drier | 02/06/2019 (all day) | Request to use BSL1 cells in Critical Point Drier | Critical Point Dryer Tousimis Automegasamdri-936 (cpd) | Approved. |
| Etching of wafers in lampoly with LiNb coated by resist | 01/22/2019 (all day) | Request to modify previously approved process for etching of wafers containing LiNb, but not etching LiNb on lampoly | Lam Research TCP 9400 Poly Etcher (lampoly) | Approved. |