This is an archive of requests from 2013 to 2021. New requests are not being added here.
PROM Request Title PROM Date PROM Request Summary Equipment List PROM Decision
Processing of wafers with embedded Tungsten alignment marks in the clean equipment group 06/19/2018 (all day) Using clean etchers to process wafers with non-clean materials. Lam Research TCP 9400 Poly Etcher (lampoly) Request approved. Data appended.
Water 18O for use in Savannah ALD 05/31/2018 (all day) Add 18O water to Savannah for ALD Savannah ALD (savannah) Request approved.
Creative Materials conductive inks: EXP 2649-76, 125-19FS, 118-41 05/29/2018 (all day) Request to use commercial conductive inks on Voltera Voltera (voltera) Request approved pending SOP submission.
CO in Fiji2 Revival 05/29/2018 (all day) Use of CO in Fiji2 and special processing requirements documentation. Revival of previous request that was successful. Fiji 2 ALD (fiji2) Request approved.
Request for Acetic Acid 04/26/2018 (all day) Request to use acetic acid in SNF Wet Bench Flexcorr 1 (wbflexcorr-1) Request approved.
InOx Thin Film Development on Savannah ALD system 04/25/2018 (all day) Develop InOx recipe on Savannah (had previously only been on Fiji2) Savannah ALD (savannah),
Woollam (woollam)
Request approved.
Thick ALD processing 04/19/2018 (all day) Deposition of films thicker than the 50nm limit Request approved. Please see process staff for details.
Continued processing of UV Laser ablated silicon wafers 04/12/2018 (all day) SNF processing of wafers that have been UV Ablated in another location Request approved.
InAs Heterostructure in Savannah 03/26/2018 (all day) Calculations performed to demonstrate no risk of As exposure in un-loadlocked Savannah system. Savannah ALD (savannah) Request approved.
Direct laser writing of a negative photoresist (mr-DWL 100) 03/22/2018 (all day) Approval to use negative resist with standard substrates on Heidelberg. Heidelberg MLA 150 (heidelberg),
Headway 3 Manual Resist Spinner (headway3)
Request approved.

Pages