This is an archive of requests from 2013 to 2021. New requests are not being added here.
| PROM Request Title | PROM Date | PROM Request Summary | Equipment List | PROM Decision |
|---|---|---|---|---|
| Water Soluble Solder Mask in ExFab | 11/28/2017 (all day) | Request to use water soluble solder mask as water soluble release layer in ExFab. | Request approved. | |
| Angled Etching of SOI in Lampoly with Anodized Aluminum Sheath Plate | 11/17/2017 (all day) | Request to use Anodized Aluminum sheath plate in Lampoly. |
Fiji 1 ALD (fiji1), Lam Research TCP 9400 Poly Etcher (lampoly) |
Request approved. |
| Angled Etching of Silicon in AMT Etcher with Aluminum Mesh | 11/17/2017 (all day) | Request to use Aluminum mesh in AMT etcher to develop angled etch recipe. | Fiji 1 ALD (fiji1) | Request approved. |
| Request to use Transene Niobium Etchant | 11/13/2017 (all day) | Transene Niobium Etchant will be used in the SNF. | Request approved. Please see process staff for details. | |
| Request for GOPTS and DBSA on Optomec | 11/13/2017 (all day) | Request to use GOPTS and DBSA on Optomec. | Optomec Printer (optomec-printer) | Request rejected due to safety concerns. |
| Request to use poly-l-lysine to functionalize substrates prior to aerosol-jet printing | 11/09/2017 (all day) | Use of poly-l-lysine in Room 155 then bringing to 155A for Optomec printing. | Optomec Printer (optomec-printer) | Request approved. |
| Ferric Chloride Nickel Etch | 10/31/2017 (all day) | Mix Ferric Chloride solution in nSiL, process in SNF. | Request approved. | |
| Slurry with Periodic Acid | 10/20/2017 (all day) | Create slurry formulations with periodic acid for Pt CMP. | CMP GnP POLI-400L (cmp) | Request approved. |
| Annealing of 1 cm2 GaAs Chip at 350 C in RTA | 10/12/2017 (all day) | Calculations performed to quanitfy exposure risk to As gas. |
RTA AllWin 610 (aw610_l), RTA AllWin 610 (aw610_r) |
Request approved. |
| Cleovis P VPCH 8000 | 10/06/2017 (all day) | Proposal to use Clevios, a form of PEDOT in the SNF | Request approved. Please see process staff for details. |