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ProM Request archive

This is an archive of requests from 2013 to 2021. New requests are not being added here.
PROM Request Title PROM Date PROM Request Summary Equipment List PROM Decision
Ta3N5 ALD in Fiji3 05/20/2017 Request for non-standard processing in Fiji3. Request approved. Fiji 3 ALD (fiji3) Request approved. Chamber isolation with HfO2 required after processing.
Electrical Test Equipment for in-cleanroom capacitance test 05/19/2017 Electrical Test Equipment for in-cleanroom capacitance test. Location reviewed with staff. Request approved.
Thick low-temp ALD Al2O3 for Insulating Spacers 05/17/2017 Request for long ALD run outside of standard operating procedure. Savannah ALD (savannah) Request approved.
Ammonium Sulfide (NH4)2S, 20% Aqueous solution 04/21/2017 Request and procedure to use (NH4)S into SNF PlasmaTherm Shuttlelock PECVD System (ccp-dep) Request approved.
Etch of wafer pieces cut by DISCO Wafersaw in Lampoly 04/13/2017 Procedure to go from wafer saw to clean Lampoly etcher. Lam Research TCP 9400 Poly Etcher (lampoly) Request approved.
Deposit LPCVD nitride on 10 nm ALD Al2O3 03/21/2017 Procedure to go from Fiji1 (semiclean) to LPCVD furnace (clean). Fiji 1 ALD (fiji1) Request approved.
Annealing of 1 cm2 GaAs Chip at 450 C in RTA 03/10/2017 Procedure to anneal As containing chips at high temperatures while minimizing safety risk for inhaling As. RTA AllWin 610 (aw610_l) Request approved.
Wet Etch Process using Nitric Acid and H2O2 03/10/2017 Use existing chemicals for Nitric and H2O2 at SNF for non standard process. Wet Bench Flexcorr 1 (wbflexcorr-1) Request approved.
Ti3Se resist and AZ400K developer for selective HF etch 02/09/2017 Request to bring new chemicals in for lithography. Headway Manual Resist Spinner (headway2) Request approved.
New Chemicals for Lithography 01/26/2017 New chemicals proposed, run sheet and preliminary results documented. Request approved. Please see process staff for details.

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