ICP Etchers
This is a summary of the ICP Etchers.
If you would like to see a summary of etchers for a specific material (i.e. SiO2 or poly silicon) please visit the materials page.
Dry Etch Equipment Summary
| Equipment Name | Processing Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Gases | Substrate Size | Maximum Load | Notes |
|---|---|---|---|---|---|---|---|---|
| Oxford III-V etcher (Ox-35) | Inductively Coupled Plasma Etching (ICP) | Flexible | 1 |
Metal etching or Metal hard masks are not allowed. 4" wafers; can be adopted to do 6" or 8"... |
||||
| Plasma Therm Versaline LL ICP Metal Etcher (PT-MTL) | Inductively Coupled Plasma Etching (ICP) | Flexible | 1 |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to... |
||||
| Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE) | Inductively Coupled Plasma Etching (ICP) | Flexible |
|
1 |
Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config;... |
|||
| Lam Research TCP 9400 Poly Etcher (lampoly) | Inductively Coupled Plasma Etching (ICP) | Clean, Semiclean | 25 |
Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching... |
||||
| Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox) | Inductively Coupled Plasma Etching (ICP) | Flexible | 1 |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to... |
||||
| Oxford Plasma Pro ICP-RIE (Ox-gen) | Inductively Coupled Plasma Etching (ICP) | Clean |
|
|
1 |
Last modified: 30 Apr 2020
