No resist allowed. Resist should have been removed at the wbclean_res-piranha.
No resist allowed. Resist should have been removed at the wbclean_res-piranha
Resist should have been removed
Resist as mask allowed
Resist will be removed
Al, Ti, or W wet etching or oxide etching
KOH or wafersaw or post-cmp decontamination
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Manual solvent cleaning of substrates or resist removal.
Manual solvent cleaning, two ultrasonic baths.
Manual solvent cleaning, hot plate
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Wet Resist Removal: SRS-100 or PRS1000
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Isotropic Si etching; can be used for backside Si removal on small pieces