Plasma Enhanced (PE) CVD |
PlasmaTherm Shuttlelock PECVD System ccp-dep |
The Plasma-Therm Shuttlelock PECVD (CCP-Dep) system is used for depositing low-stress silicon nitride, silicon dioxide, amorphous and silicon carbide, and silicon oxynitride layers on 4 inch wafers.
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All |
SNF Cleanroom Paul G Allen L107 |
Plasma Enhanced (PE) CVD |
PlasmaTherm Versaline HDP CVD System hdpcvd |
High Density Plasma Enhanced Chemical Vapor Deposition (HD PECVD) system is used to deposit silicon dioxide, silicon nitride and amorphous silicon.
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All |
SNF Cleanroom Paul G Allen L107 |
Thermal ALD |
Savannah ALD savannah |
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Low Pressure (LP) CVD |
Tystar Bank 1 Tube 3 Poly B1T3 Flexible Poly |
LPCVD of Poly silicon, Amorphous Silicon, Doped Silicon, Silicon-Germanium.
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Low Pressure (LP) CVD |
Tystar Bank 1 Tube 4 LTO B1T4 Flexible LTO |
LPCVD of Low Temperatur Oxide, PSG, BSG, BPSG.
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Low Pressure (LP) CVD |
Tystar Bank 2 Tube 7 Nitride B2T7 Clean Nitride |
LPCVD of Stoichiometric silicon nitride, low-stress silicon nitride, Silicon Oxy Nitride.
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Clean |
SNF Cleanroom Paul G Allen L107 |
Low Pressure (LP) CVD |
Tystar Bank 2 Tube 8 LTO B2T8 Clean LTO |
LPCVD of Low Temperatur Oxide, PSG, BSG, BPSG.
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Clean |
SNF Cleanroom Paul G Allen L107 |
Low Pressure (LP) CVD |
Tystar Bank 3 Tube 10 Nitride B3T10 Clean Nitride |
LPCVD of Silicon Nitride, Stoichiometric silicon nitride, low-stress silicon nitride, Silicon Oxy Nitride.
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Clean |
SNF Cleanroom Paul G Allen L107 |
Low Pressure (LP) CVD |
Tystar Bank 3 Tube 11 TEOS B3T11 Clean TEOS |
LPCVD of TEOS Oxide.
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Clean |
SNF Cleanroom Paul G Allen L107 |
Low Pressure (LP) CVD |
Tystar Bank 3 Tube 12 Poly B3T12 Clean Poly |
LPCVD of Poly silicon, Amorphous Silicon, Doped Silicon.
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Clean |
SNF Cleanroom Paul G Allen L107 |
Patterning, Ink |
Voltera voltera |
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Flexible |
SNF Exfab Paul G Allen 151 Ocean |