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Piranha Cleaning

Piranha Cleaning is used to refer to mixtures of sulfuric acid (H2SO4) and hydrogen peroxide (H2O2). There are various ratios and temperatures that can be used depending on what is being cleaned off and what your substrate can withstand. Pirhana cleans are often used to remove reisist, clean resist residues and post-etch sidewall polymer residues. Piranha cleans will also remove metals.

The specific wet bench you will need to use will depend on your substrate material, substrate size, other materials on your substrate, and the contamination level of your part. (For more about the contamination categories, please visit the Cleanliness (previously Contamination) Groups page).

Technique Tabs

Main Tab
Processing Techniques Equipment name & NEMO ID Teaser Blurb Cleanliness Location
Piranha Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Clean_res-piranha
wbclean_res-piranha

Wet Bench Clean_res-piranha is part of the 'clean' cleanliness group and is used to clean or remove resist from 3", 4", and 6" silicon, quartz, and silicon germanium wafers using piranha. 2 baths are available and can hold up to 25 wafers.

 Clean SNF Paul G Allen L107 Cleanroom
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing Wet Bench Flexcorr 1
wbflexcorr-1

Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot plate available. GaAs allowed in personal labware only.

 Flexible SNF Paul G Allen L107 Cleanroom
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 2
wbflexcorr-2

Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot pots available. GaAs allowed in personal labware only.

 Flexible SNF Paul G Allen L107 Cleanroom
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 3
wbflexcorr-3

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.

 Flexible SNF Paul G Allen L107 Cleanroom
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 4
wbflexcorr-4

Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.

 Flexible SNF Paul G Allen L107 Cleanroom
Detail Tab
Processing Technique Equipment name & NEMO ID Cleanliness Chemicals Primary Materials Etched Other Materials Etched Substrate Size Notes
Piranha Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Clean_res-piranha
wbclean_res-piranha 		Clean

Resist will be removed
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing Wet Bench Flexcorr 1
wbflexcorr-1 		Flexible

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 2
wbflexcorr-2 		Flexible

Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 3
wbflexcorr-3 		Flexible

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 4
wbflexcorr-4 		Flexible

Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.
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