Piranha Cleaning

Piranha Cleaning is used to refer to mixtures of sulfuric acid (H₂SO₄) and hydrogen peroxide (H₂O₂). There are various ratios and temperatures that can be used depending on what is being cleaned off and what your substrate can withstand. Pirhana cleans are often used to remove reisist, clean resist residues and post-etch sidewall polymer residues. Piranha cleans will also remove metals.

The specific wet bench you will need to use will depend on your substrate material, substrate size, other materials on your substrate, and the contamination level of your part. (For more about the contamination categories, please visit the Cleanliness (previously Contamination) Groups page).

Technique Tabs

Main Tab

Processing Techniques	Equipment name & NEMO ID	Teaser Blurb	Cleanliness	Location
Piranha Cleaning, Wet Resist Removal, Wet Chemical Processing	Wet Bench Clean_res-piranha wbclean_res-piranha	Wet Bench Clean_res-piranha is part of the 'clean' cleanliness group and is used to clean or remove resist from 3", 4", and 6" silicon, quartz, and silicon germanium wafers using piranha. 2 baths are available and can hold up to 25 wafers.	Clean	SNF Cleanroom Paul G Allen L107
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing	Wet Bench Flexcorr 1 wbflexcorr-1	Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot plate available. GaAs allowed in personal labware only.	Flexible	SNF Cleanroom Paul G Allen L107
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing	Wet Bench Flexcorr 2 wbflexcorr-2	Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot pots available. GaAs allowed in personal labware only.	Flexible	SNF Cleanroom Paul G Allen L107
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing	Wet Bench Flexcorr 3 wbflexcorr-3	Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.	Flexible	SNF Cleanroom Paul G Allen L107
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing	Wet Bench Flexcorr 4 wbflexcorr-4	Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.	Flexible	SNF Cleanroom Paul G Allen L107

Detail Tab

Processing Technique	Equipment name & NEMO ID	Cleanliness	Chemicals	Primary Materials Etched	Other Materials Etched	Substrate Size	Notes
Piranha Cleaning, Wet Resist Removal, Wet Chemical Processing	Wet Bench Clean_res-piranha wbclean_res-piranha	Clean	9:1 Piranha			3" 4" 6"	Resist will be removed
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing	Wet Bench Flexcorr 1 wbflexcorr-1	Flexible	Acids Bases Gold Etchant 20:1 BOE 50:1 HF 6:1 BOE 9:1 Piranha Al-Etch Chrome Etch KOH SC1 SC2	Metals Al Au Cr Si SiO₂ Resist	GaAs Si3N4 Ti W	Pieces 2" 3" 4" 6"	Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing	Wet Bench Flexcorr 2 wbflexcorr-2	Flexible	Acids Bases			Pieces 2" 3" 4" 6"	Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing	Wet Bench Flexcorr 3 wbflexcorr-3	Flexible	Acids Bases			Pieces 2" 3" 4" 6"	Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing	Wet Bench Flexcorr 4 wbflexcorr-4	Flexible	Acids Bases			Pieces 2" 3" 4" 6"	Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.