Resist UV Cure |
Ultraviolet Photoresist Cure uvcure |
Ultraviolet Photoresist Cure, primary wavelength is 254 nm.
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All |
SNF Cleanroom Paul G Allen L107 |
Resist Coat (manual) |
Headway 3 Manual Resist Spinner headway3 |
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All |
SNF Exfab Paul G Allen 104 Stinson |
Contact Aligner |
EVG Contact Aligner evalign |
1:1 Contact Mask Aligner, 1.5 um resolution, single wafer, manual system
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All |
SNF Cleanroom Paul G Allen L107 |
Contact Aligner |
Karl Suss MA-6 Contact Aligner karlsuss |
Karl Suss MA-6 Mask Aligner is a 1:1 Contact Aligner, 1.5 um resolution, single wafer, manual system (Backside align, including IR).
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All |
SNF Cleanroom Paul G Allen L107 |
Contact Aligner |
Karl Suss MA-6 Contact Aligner karlsuss2 |
Karl Suss MA-6 Mask Aligner is a 1:1 Contact Aligner, 1.5 um resolution, single wafer, manual system (Backside align, including IR).
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All |
SNF Cleanroom Paul G Allen L107 |
Mask Cleaning (manual), Wet Chemical Processing |
Mask Scrubber masksrub |
Manual mask cleaner for one 5 inch mask, water under pressure.
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All |
SNF Cleanroom Paul G Allen L107 |
Stepper |
ASML PAS 5500/60 i-line Stepper asml |
ASML PAS 5500/60 i-line stepper, automatic for 25 inch wafers, 450nm resolution, 365nm near-UV light
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All |
SNF Cleanroom Paul G Allen L107 |
Oven Bake |
Oven (White) white-oven |
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Resist Coat (manual) |
Headway Manual Resist Spinner headway2 |
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All |
SNF Cleanroom Paul G Allen L107 |
Resist Develop (automatic) |
SVG Develop Track 1 svgdev |
Automatic resist development of 4" wafers in cassette holding up to 25 wafers.
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All |
SNF Cleanroom Paul G Allen L107 |
Resist Develop (automatic) |
SVG Develop Track 2 svgdev2 |
Automatic resist development of 4" wafers in cassette holding up to 25 wafers.
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All |
SNF Cleanroom Paul G Allen L107 |
Resist Coat (automatic) |
SVG Resist Coat Track 2 svgcoat2 |
Resist coater and bake (automatic) for 4 inch wafers.
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All |
SNF Cleanroom Paul G Allen L107 |
Resist Coat (automatic) |
SVG Resist Coat Track 1 svgcoat |
Resist coater and bake (automatic) for 4 inch wafers.
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All |
SNF Cleanroom Paul G Allen L107 |
Resist Prebake |
Oven 90°C prebake oven90 |
The 90°C Oven is the 90°C prebake oven. It is used to bake wafers after resist coating.
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All |
SNF Cleanroom Paul G Allen L107 |
Resist Post Bake |
Oven 110°C post-bake oven110 |
The 110°C Oven bakes the wafers with resist at 110ºC after the development, called post-bake.
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All |
SNF Cleanroom Paul G Allen L107 |
Oven Bake |
Oven BlueM 200°C to 430°C bluem |
The BlueM oven is for 200°C to 437°C temperature bakes, i.e. polyimide.
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Direct Write |
Heidelberg MLA 150 heidelberg |
Maskless writer that patterns without prior fabrication of masks.
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All |
SNF Exfab Paul G Allen 104 Stinson |
Direct Write |
Heidelberg MLA 150 - 2 heidelberg2 |
Maskless writer that patterns without prior fabrication of masks.
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All |
SNF Cleanroom Paul G Allen L107 |
Resist Develop (manual), Wet Chemical Processing |
Wet Bench Miscellaneous wbmiscres |
Manual developing of photoresist using mainly AZ1:1 developer.
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Resist Develop (manual), Wet Chemical Processing |
Ex Fab Develop Wet Bench wbexfab_dev |
Manual developing of photoresist using mainly MF-26A.
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Flexible |
SNF Exfab Paul G Allen 104 Stinson |