Skip to content Skip to navigation

Quartz

Chemical Formula: 
SiO2
Subscribe to
Equipment name & NEMO ID Training Required & Charges Cleanliness Location Notes
Aixtron MOCVD - III-V system
aix200
MOCVD - III-V Aixtron training Flexible SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For III-V clean: HCl or HF dip.

AJA Evaporator
aja-evap
Evaporator AJA training Flexible SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

AJA2 Evaporator
aja2-evap
Evaporator AJA2 Training Flexible SNF Cleanroom Paul G Allen L107

For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in advance

ASML PAS 5500/60 i-line Stepper
asml
Stepper ASML PAS 5500/60 i-line Training All SNF Cleanroom Paul G Allen L107

5:1 reducing stepper

CHA Solutions II Evaporator
cha-evap
Evaporator CHA Training Flexible SNF Cleanroom Paul G Allen L107

For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance

Critical Point Dryer Tousimis Automegasamdri-936
cpd
Critical Point Dryer Training Flexible SNF Cleanroom Paul G Allen L107

CO2 drying after release of micromachined devices

DISCO Wafer Saw
DISCO wafersaw
Wafersaw DISCO training Flexible SNF Exfab Paul G Allen 159 Capitola
EVG 101 Spray Coater
evgspraycoat
Spray Coater EVG 101 Training All SNF Cleanroom Paul G Allen L107

Spray coating of resists

EVG Contact Aligner
evalign
Contact Aligner EVG Training All SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Anodic Bond, backside align, including IR.

Fiji 1 ALD
fiji1
ALD Fiji 1 and 2 Training Semiclean SNF Cleanroom Paul G Allen L107
Fiji 2 ALD
fiji2
ALD Fiji 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107
Finetech Lambda
flipchipbonder
Flip Chip Bonder Training Flexible SNF Exfab Paul G Allen 104 Stinson
First Nano carbon nanotube CVD furnace
cvd-nanotube
cvd-nanotube training Flexible SNF Exfab Paul G Allen L119 Año Nuevo

Aligned single-walled carbon nanotube growth with ST-cut quartz substrates (available from SNF stockroom);1-15 single-walled carbon nanotubes per micron density

Flexus 2320 Stress Tester
stresstest
Stress Tester Flexus 2320 Training All SNF Cleanroom Paul G Allen L107
Headway Manual Resist Spinner
headway2
Resist Coat (manual) Headway Manual Training All SNF Cleanroom Paul G Allen L107

Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists

Heidelberg MLA 150
heidelberg
Heidelberg Training All SNF Exfab Paul G Allen 104 Stinson

Direct Write

Heidelberg MLA 150 - 2
heidelberg2
Heidelberg Training All SNF Cleanroom Paul G Allen L107

Direct Write

HMDS Vapor Prime Oven, YES
yes
YES Prime Oven Training All SNF Cleanroom Paul G Allen L107

Two programs: Singe and HMDS prime or Singe only. No Resist allowed!

Intlvac Evaporator
Intlvac_evap
Evaporator Intlvac Training Clean, Semiclean SNF Cleanroom Paul G Allen L107
Karl Suss MA-6 Contact Aligner
karlsuss
Contact Aligner Karl Suss MA-6 Training All SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Backside align, including IR.

Pages

Equipment name & NEMO ID Technique Cleaning Required Cleanliness Material Thickness Range Materials Lab Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
Aixtron MOCVD - III-V system
aix200
Pre-Diffusion Clean Flexible
0.00 - 5.00 μm
300 °C - 800 °C
,
,
,
4"x1 wafer or 2"x1 wafer or 4 pieces
AJA Evaporator
aja-evap
Flexible
0.00 - 300.00 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
AJA2 Evaporator
aja2-evap
Flexible
0.00 - 300.00 nm
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
ASML PAS 5500/60 i-line Stepper
asml
All
365 nm 5 inch
,
,
,
,
CHA Solutions II Evaporator
cha-evap
Flexible
0.00 - 300.00 nm
,
,
,
,
,
4"x15 or 6"x3 wafers or pieces
Critical Point Dryer Tousimis Automegasamdri-936
cpd
Flexible
,
,
,
,
,
,
,
,
,
DISCO Wafer Saw
DISCO wafersaw
Flexible ,
,
,
,
,
,
,
1x4", 1x6" or 1x8" wafer, or pieces
EVG 101 Spray Coater
evgspraycoat
All ,
,
,
,
1
EVG Contact Aligner
evalign
All
350 - 450 nm 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch ,
,
,
,
one piece or wafer
Fiji 1 ALD
fiji1
Semiclean
1.00 Å - 50.00 nm
24 °C - 350 °C
,
,
Fiji 2 ALD
fiji2
Flexible
1.00 Å - 50.00 nm
24 °C - 350 °C
,
,
,
,
,
,
,
,
,
,
,
,
Finetech Lambda
flipchipbonder
Flexible
°C - 400 °C
,
,
,
,
,
1
First Nano carbon nanotube CVD furnace
cvd-nanotube
Flexible
800 °C - 1100 °C
,
1x4" wafer or multiple pieces
Flexus 2320 Stress Tester
stresstest
All ,
,
,
,
,
,
,
,
1
Headway Manual Resist Spinner
headway2
All ,
,
,
,
,
,
,
,
,
one piece or wafer
Heidelberg MLA 150
heidelberg
All
405 nm ,
,
,
,
,
,
,
,
,
,
,
,
1
Heidelberg MLA 150 - 2
heidelberg2
All
375 nm ,
,
,
,
,
,
,
,
,
,
,
,
1
HMDS Vapor Prime Oven, YES
yes
All
150 ºC
,
,
,
,
,
,
,
,
Intlvac Evaporator
Intlvac_evap
Clean, Semiclean
0.00 - 0.50 μm
,
,
12 4 inch wafers, 2 6 inch wafers
Karl Suss MA-6 Contact Aligner
karlsuss
All
365 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch ,
,
,
,
,
,
,
,
,

Pages