Overview

The SAMCO etcher is a multifunctional etcher that can operate in either the RIE, plasma etch or Downstream plasma modes.  There are 3 gases that are plumbed to the tool: Gas1: O2, Gas2: CF4, and Gas3: SF6.  The characterized etches allowed in this tool include O2 descum, PhotoResist strip, Silicon-Nitride etch, isotropic silicon etch.

 
Cleanliness: 
Flexible

Processing Technique(s)

Capabilities and Specifications

Primary Materials Etched

Primary Materials Etched: 
Photoresist

Other Materials Etched

Other Materials Etched: 
PDMS
Polyimide
Polymer
Silicon Oxynitride
Silicon Nitride
Silicon Dioxide
Silicon

Process Temperature Range:

20 ºC

Substrate Sizes

Pieces
2 inch wafer
3 inch wafer
4 inch wafer
6 inch wafer
8 inch wafer
Other form factors
Maximum Load: 
Four 4" wafers or two 6" wafers and one 8" wafer

Lab Organization, Location, and NEMO Information

Lab Organization: 

Stanford Nanofabrication Facility (SNF)

Location: 
SNF Paul G Allen L107 Cleanroom
NEMO Area: 
SNF: Dry Etching
NEMO ID: 
samco

Training and Maintenance

Lab Facility: 
SNF
Training Charges: 
0.50 hours
Primary Trainer: 
Lavendra Mandyam
Backup Trainer(s): 
Rachelle Salmani
Primary Maintenance: 
Elmer Enriquez

Steps to become a tool user

  1. Become a member of nano@stanford.

  2. Become a member of SNF.

  3. Study the relevant operating procedures:

  4. Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or SNF usage to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF

  5. Contact the primary trainer: Lavendra Mandyam