Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
1:1 Contact Aligner. Backside align, including IR.
1:1 Contact Aligner. Backside align.
Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
Bakes wafers with resist after the development, called post-bake.
Bakes wafers after resist coating.
Convection in N2. Cure. Programmable.
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers
