There are many options available to remove resist from your substrate. Dry methods use plasma O2 to react with the resist, while wet methods use either solvents to dissolve the resist or oxidizing chemistries to react with the resist. For processes that are sensitive to resist residues, resist removal can consist of both a dry and a wet clean. 

The cleaning method you will need will depend on the materials on your substrate as well as your substrate itself in addition cleanliness category of your sample. (For more about the cleanliness categories, please visit the Cleanliness (previously Contamination) Groups page).

Processing Techniques Equipment name & NEMO ID Teaser Blurb Cleanliness Location
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching Gasonics Aura Asher
gasonics

The Gasonics Aura Asher is an automated down stream microwave plasma system used for stripping photoresist of 4 inch wafers in the 'clean' cleanliness group.

 Clean, Semiclean SNF Paul G Allen L107 Cleanroom
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching Matrix Plasma Resist Strip
matrix

The Matrix plasma asher is used to strip photoresist from contaminated wafers using a combination of oxygen plasma, high power, higher pressure and a heated chuck (platen).

 Flexible SNF Paul G Allen L107 Cleanroom
Plasma Mode Etching, Reactive Ion Etching (RIE), Downstream/Remote Plasma Resist Removal Samco PC300 Plasma Etch System
samco

The SAMCO etcher is a multifunctional etcher that can operate in either the RIE, plasma etch or Downstream plasma modes

 Flexible SNF Paul G Allen L107 Cleanroom
Dry Resist Removal, Dry Etching Technics Asher
technics

Technics PE II-A is used for descum, resist strip and surface treatment with O2 plasma

 Flexible SNF Paul G Allen L107 Cleanroom
Piranha Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Clean_res-piranha
wbclean_res-piranha

Wet Bench Clean_res-piranha is part of the 'clean' cleanliness group and is used to clean or remove resist from 3", 4", and 6" silicon, quartz, and silicon germanium wafers using piranha. 2 baths are available and can hold up to 25 wafers.

 Clean SNF Paul G Allen L107 Cleanroom
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing Wet Bench Flexcorr 1
wbflexcorr-1

Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot plate available. GaAs allowed in personal labware only.

 Flexible SNF Paul G Allen L107 Cleanroom
Solvent Cleaning, Wet Resist Removal, Metal Lift-off Wet Bench Flexible Solvents
wbflexsolv

Manual solvent cleaning of materials in the flexible cleanliness group.

 Flexible SNF Paul G Allen L107 Cleanroom
Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Flexible Solvents 1
wbflexsolv-1

Manual solvent cleaning, two ultrasonic baths.

 Flexible SNF Paul G Allen L107 Cleanroom
Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Flexible Solvents 2
wbflexsolv-2

Manual solvent cleaning and resist removal, hot plate.

 Flexible SNF Paul G Allen L107 Cleanroom
Wet Resist Removal, Wet Chemical Processing Wet Bench Resist Strip
wbresstrip-1

Wet bench to remove resist using SRS-100 or PRS1000.

 Clean (Ge), Semiclean, Flexible SNF Paul G Allen L107 Cleanroom