Equipment name & NEMO ID | Technique | Cleaning Required | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Materials User Supplied | Process Temperature Range | Gases | Sample Size Limits | Resolution Notes | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Lakeshore Hall Measurement System LakeshoreHall |
All |
100.00 μm -
1000.00 μm
|
-258 °C - 1000 °C
|
8 in wafer |
Sensor Transducer Size is 14 mm diameter |
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1 piece | ||||||||
Lam Research TCP 9400 Poly Etcher lampoly |
Clean, Semiclean |
, |
25 | ||||||||||||
LEI1500 Contactless Sheet Resistance Mapping eddycurrent |
All | 8 in wafer |
Sensor Transducer Size is 14 mm diameter |
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1 wafer(2" to 8") | ||||||||||
Lesker Sputter lesker-sputter |
Flexible |
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1 4 inch wafer, 1 6 inch wafer | ||||||||||||
Lesker2 Sputter lesker2-sputter |
Semiclean |
1.00 μm
|
°C - 800 °C
|
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one 4 inch wafer, one 6 inch wafer | ||||||||||
Matrix Plasma Resist Strip matrix |
Flexible |
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25 | ||||||||||||
micromanipulator6000 IV-CV probe station micromanipulator6000 |
All |
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1x4" wafer | ||||||||||||
Nanospec 210XP nanospec2 |
All |
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Oven (White) white-oven |
Flexible |
0 °C - 200 °C
|
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Oven 110°C post-bake oven110 |
All |
110 ºC
|
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Oven 90°C prebake oven90 |
All |
90 ºC
|
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Oven BlueM 200°C to 430°C bluem |
Flexible |
0 °C - 430 °C
|
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Oxford Dielectric Etcher oxford-rie |
Flexible |
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1 | ||||||||||||
Oxford Plasma Pro ICP-RIE Ox-gen |
Clean |
-10 °C - 60 °C
|
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1 | |||||||||||
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Flexible |
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PlasmaTherm Shuttlelock PECVD System ccp-dep |
All |
100.00 Å -
4.00 μm
|
100 °C - 350 °C
|
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4 | ||||||||||
Profilometer Alphastep 500 alphastep |
Flexible |
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1 | ||||||||||||
Profilometer AlphaStep D-300 alphastep2 |
Flexible |
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1 | ||||||||||||
Prometrix Resistivity Mapping System prometrix |
All |
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1 | ||||||||||||
RTA AllWin 610 aw610_l |
Pre-Diffusion Clean | Clean |
21 °C - 1150 °C
|
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1 wafer |