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ProM Request archive

This is an archive of requests from 2013 to 2021. New requests are not being added here.
PROM Request Title PROM Date PROM Request Summary Equipment List PROM Decision
Request for Zinc Phosphorus Dopant Coating 04/10/2014 Request to dispense and anneal Zinc Phosphorus spin on dopant in SNF. Rejected.
Etching Polyacrylonitrile-Lithium Perchlorate membrane with Au mask 03/17/2014 Request to use PAN-LiClO4 film in PT-OX. Concern is using Li compounds in the shared equipment. Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox) Approved for documented runs. Additional runs or larger substrates will require review by PROM committee.
Poly-Si Deposition on Mo/Si substrate in ThermcoPoly2 (LPCVD) 03/07/2014 Deposition of poly-Si on Mo/Si substrate in ThermocoPoly2 requires approval to demonstrate low vapor pressure of Mo at process conditions. Approved. Any changes to documented request will require re-evaluation by committee.
Li2CO3 ALD 02/28/2014 Request to perform ALD of Li2CO3 in Savannah. Request requires new precursors, equipment modification, and significant handling procedural changes to address safety issues. Savannah ALD (savannah) Conditional Approval. Process is approved as documented. Equipment modifications will need to be documented and reviewed by PROM Committee.
Encapsulated 1cm2 GaAs Substrate Annealing in RTA 02/26/2014 Encapsulated 1cm2 GaAs substrate annealing in RTA. GaAs substrates are not allowed in RTA without approval. RTA AllWin 610 (aw610_r) Approved. Any changes to documented request will require re-evaluation by committee.
Crystal Bond 509 in Xactix (XeFe2) Etcher 02/21/2014 Request to use Crystal Bond 509 in Xactix (XeFe2) Etcher. Crystal Bond 509 is approved for lab use but not standard for Xactix. Xactix Xenon Difluoride Etcher (xactix) Approved for use with gold contaminated chuck.
Clean Processing of Aluminum post CMP 02/21/2014 Clean contamination category processing of Aluminum post CMP. Requires Al compatible clean (standard decon procedure includes SC2 which etches Al). PlasmaTherm Shuttlelock PECVD System (ccp-dep),
CMP GnP POLI-400L (cmp)
Approved to use the standard metal clean for post CMP clean and CCP or HD CVD oxide tools in clean contamination state.
Tantalum Sputter Target for Metallica 02/19/2014 Request to introduce Ta target for Metallica. Approved. Process parameters to be developed with J. Conway.
Spin coat substrates with graphene 02/11/2014 Request to use Headway spinner in SNF to spin coat graphene particles on substrates. Headway Manual Resist Spinner (headway2),
Laurell Manual Resist Spinner (laurell-R)
Approved for Laurell spinner OUTSIDE of SNF. No loose nanoparticles to be spun inside of cleanroom.
Mercury Cadmium Telluride on a Zinc Cadmium Telluride Substrate 02/07/2014 Request for HgCdTe on ZnCdTe substrate for use in e-beam lithography. Headway Manual Resist Spinner (headway2) Approved.

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