ProM Request archive
This is an archive of requests from 2013 to 2021. New requests are not being added here.
| PROM Request Title | PROM Date | PROM Request Summary | Equipment List | PROM Decision |
|---|---|---|---|---|
| Request for Zinc Phosphorus Dopant Coating | 04/10/2014 | Request to dispense and anneal Zinc Phosphorus spin on dopant in SNF. | Rejected. | |
| Etching Polyacrylonitrile-Lithium Perchlorate membrane with Au mask | 03/17/2014 | Request to use PAN-LiClO4 film in PT-OX. Concern is using Li compounds in the shared equipment. | Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox) | Approved for documented runs. Additional runs or larger substrates will require review by PROM committee. |
| Poly-Si Deposition on Mo/Si substrate in ThermcoPoly2 (LPCVD) | 03/07/2014 | Deposition of poly-Si on Mo/Si substrate in ThermocoPoly2 requires approval to demonstrate low vapor pressure of Mo at process conditions. | Approved. Any changes to documented request will require re-evaluation by committee. | |
| Li2CO3 ALD | 02/28/2014 | Request to perform ALD of Li2CO3 in Savannah. Request requires new precursors, equipment modification, and significant handling procedural changes to address safety issues. | Savannah ALD (savannah) | Conditional Approval. Process is approved as documented. Equipment modifications will need to be documented and reviewed by PROM Committee. |
| Encapsulated 1cm2 GaAs Substrate Annealing in RTA | 02/26/2014 | Encapsulated 1cm2 GaAs substrate annealing in RTA. GaAs substrates are not allowed in RTA without approval. | RTA AllWin 610 (aw610_r) | Approved. Any changes to documented request will require re-evaluation by committee. |
| Crystal Bond 509 in Xactix (XeFe2) Etcher | 02/21/2014 | Request to use Crystal Bond 509 in Xactix (XeFe2) Etcher. Crystal Bond 509 is approved for lab use but not standard for Xactix. | Xactix Xenon Difluoride Etcher (xactix) | Approved for use with gold contaminated chuck. |
| Clean Processing of Aluminum post CMP | 02/21/2014 | Clean contamination category processing of Aluminum post CMP. Requires Al compatible clean (standard decon procedure includes SC2 which etches Al). |
PlasmaTherm Shuttlelock PECVD System (ccp-dep), CMP GnP POLI-400L (cmp) |
Approved to use the standard metal clean for post CMP clean and CCP or HD CVD oxide tools in clean contamination state. |
| Tantalum Sputter Target for Metallica | 02/19/2014 | Request to introduce Ta target for Metallica. | Approved. Process parameters to be developed with J. Conway. | |
| Spin coat substrates with graphene | 02/11/2014 | Request to use Headway spinner in SNF to spin coat graphene particles on substrates. |
Headway Manual Resist Spinner (headway2), Laurell Manual Resist Spinner (laurell-R) |
Approved for Laurell spinner OUTSIDE of SNF. No loose nanoparticles to be spun inside of cleanroom. |
| Mercury Cadmium Telluride on a Zinc Cadmium Telluride Substrate | 02/07/2014 | Request for HgCdTe on ZnCdTe substrate for use in e-beam lithography. | Headway Manual Resist Spinner (headway2) | Approved. |
