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ProM Request archive

This is an archive of requests from 2013 to 2021. New requests are not being added here.
PROM Request Title PROM Date PROM Request Summary Equipment List PROM Decision
Etching FOx-22 in PT-MTL 07/25/2014 Request to etch FOx-22 spin on glass in PT-MTL etcher. Plasma Therm Versaline LL ICP Metal Etcher (PT-MTL) Approved. PT-Ox recommended due to CHF3 availability but material is approved for PT-MTL.
Etching Cytop 809M in PT-Ox 07/25/2014 Request to etch Cytop spin on glass in PT-Ox etcher. Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox) Approved.
Use of Crystal Bond 509-HMP in Lampoly 07/15/2014 Request to use Crystal Bond 509 to mount chips on wafer in Lampoly etcher. Lam Research TCP 9400 Poly Etcher (lampoly) Conditional approval. Crystal Bond use requires additional characterization and procedure definition. Alternatives proposed.
Use of Crystalbond 555 in Lampoly 07/15/2014 Request to use Crystal Bond 555 to mount chips on wafer in Lampoly etcher. AMAT P5000 Etcher (p5000etch),
Lam Research TCP 9400 Poly Etcher (lampoly)
Conditional approval. Crystal Bond use requires additional characterization and procedure definition. Alternatives proposed.
GaAs processing and citric acid introduction 06/25/2014 Request to use GaAs substrates in gold contamination level tools and to bring in citric acid. Wet Bench Flexcorr 1 (wbflexcorr-1) Approved.
Use of Copper Mask in SF6/O2 chemistry in PT-MTL 06/10/2014 Request to use copper as a masking layer for etch in PT-MTL using SF6/O2 chemistry. Plasma Therm Versaline LL ICP Metal Etcher (PT-MTL) Rejected. Risks to both equipment and subsequent users deemed too high. Efforts to find alternative path ongoing.
Lanthanum Hexaboride (LaB6) and Cerium Hexaboride (CeB6) Sputtering in Metalica 06/02/2014 Request for new sputtering targets (LaB6 and CeB6) for use in Metalica Approved.
Request for use of glass wafer cleaning detergent 05/29/2014 Request to use Alconex Detergent 8 and Borer Chemie AG Deconex NS-x to clean glass wafers for particle removal. Approved. 1 gallon chemical needs to be poured into smaller amber bottle for storage in the lab.
CLK-820 05/16/2014 Request to use J.T. Baker CLK-820 photoresist stripper for Cu on an ongoing basis. Wet Bench Flexcorr 1 (wbflexcorr-1) Approved.
Resist in HF vapor etcher 05/07/2014 Request to use resist covered wafer in HF vapor etcher (currently not allowed). Approved. Final call on processing to be determined by Gary Yama.

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