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Silicon Carbide

Chemical Formula: 
SiC
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Equipment name & NEMO ID Training Required & Charges Cleanliness Location Notes
SPTS uetch vapor etch
uetch
SPTS uetch vapor etch Training All SNF Paul G Allen L107 Cleanroom

Pieces need a carrier wafer; Isotropic Etching

Tystar Bank 1 Tube 3 Poly
B1T3 Flexible Poly
Tystar LPCVD Tube Training Flexible SNF Paul G Allen L107 Cleanroom
Tystar Bank 1 Tube 4 LTO
B1T4 Flexible LTO
Tystar LPCVD Tube Training Flexible SNF Paul G Allen L107 Cleanroom
Wet Bench Flexcorr 1
wbflexcorr-1
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Paul G Allen L107 Cleanroom

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.

Wet Bench Flexcorr 2
wbflexcorr-2
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Paul G Allen L107 Cleanroom

Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only

Wet Bench Flexcorr 3
wbflexcorr-3
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Paul G Allen L107 Cleanroom

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.

Wet Bench Flexible Solvents
wbflexsolv
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Paul G Allen L107 Cleanroom

Manual solvent cleaning of substrates or resist removal.

Wet Bench Flexible Solvents 1
wbflexsolv-1
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Paul G Allen L107 Cleanroom

Manual solvent cleaning, two ultrasonic baths.

Wet Bench Flexible Solvents 2
wbflexsolv-2
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Paul G Allen L107 Cleanroom

Manual solvent cleaning, hot plate

Wet Bench Resist Strip
wbresstrip-1
Wet Bench Resist Strip Clean (Ge), Semiclean, Flexible SNF Paul G Allen L107 Cleanroom

Wet Resist Removal: SRS-100 or PRS1000

Woollam
woollam
Woollam Training All SNF Paul G Allen L107 Cleanroom
Xactix Xenon Difluoride Etcher
xactix
Xactix Xenon Difluoride Etcher Training All SNF Paul G Allen L107 Cleanroom

Isotropic Si etching; can be used for backside Si removal on small pieces

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Equipment name & NEMO ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
SPTS uetch vapor etch
uetch
All ,
,
,
,
,
,
,
,
,
1
Tystar Bank 1 Tube 3 Poly
B1T3 Flexible Poly
Flexible
25.00 Å - 2.00 μm
420 °C - 630 °C
,
,
,
,
,
100
Tystar Bank 1 Tube 4 LTO
B1T4 Flexible LTO
Flexible
25.00 Å - 2.00 μm
300 °C - 500 °C
,
,
,
,
,
100
Wet Bench Flexcorr 1
wbflexcorr-1
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Flexcorr 2
wbflexcorr-2
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Flexcorr 3
wbflexcorr-3
Flexible ,
,
,
,
,
,
,
,
,
Wet Bench Flexible Solvents
wbflexsolv
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Flexible Solvents 1
wbflexsolv-1
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Flexible Solvents 2
wbflexsolv-2
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Resist Strip
wbresstrip-1
Clean (Ge), Semiclean, Flexible
20 °C - 60 °C
,
,
,
,
,
,
25 4 inch wafers
Woollam
woollam
All ,
,
,
,
,
,
,
,
,
,
,
,
,
1
Xactix Xenon Difluoride Etcher
xactix
All ,
,
,
,
,
,
,
,
,
1

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