Methane | Stanford Nanofabrication Facility

Chemical Formula:

CH₄

Etch Equipment
Equipment name & NEMO ID	Cleanliness	Location	Primary Materials Etched	Other Materials Etched	Gases
Oxford III-V etcher Ox-35	Flexible	SNF Paul G Allen L107 Cleanroom	GaAs	AlGaN AlInP GaN InGaP InSb	Ar BCl₃ CH₄ Cl₂ H₂ HBr N₂ O₂ SF₆
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL	Flexible	SNF Paul G Allen L107 Cleanroom	Metals or metal compounds with volatile byproducts Al	GaN	Ar BCl₃ CF₄ CH₄ Cl₂ N₂ O₂ SF₆
Oxford Plasma Pro ICP-RIE Ox-gen	Flexible	SNF Paul G Allen L107 Cleanroom			Ar BCl₃ CF₄ CH₄ Cl₂ H₂ N₂ O₂ SF₆

Deposition Equipment
Equipment name & NEMO ID	Cleanliness	Location	Material Thickness Range	Approved Materials supplied by Lab
PlasmaTherm Shuttlelock PECVD System ccp-dep	"All"	SNF Paul G Allen L107 Cleanroom	100.00 Å - 4.00 μm	Si Si3N4 SiC SiO₂ SiON
Oxford Plasma Pro PECVD Ox-PECVD	Semiclean Flexible	SNF Paul G Allen L107 Cleanroom	100.00 Å - 4.00 μm	Si Si3N4 SiC SiO₂ SiON
First Nano carbon nanotube CVD furnace cvd-nanotube	Flexible	SNF Exfab Paul G Allen L119 Año Nuevo		C
Aixtron Black Magic graphene CVD furnace aixtron-graphene	Flexible	SNF Exfab Paul G Allen L119 Año Nuevo		C