MOCVD is a chemical vapour deposition method using metal organics to produce single- or polycrystalline thin films. It is a process for growing crystalline layers to create complex semiconductor multilayer structures.
| Processing Technique | Equipment name & NEMO ID | Cleanliness | Materials Lab Supplied | Material Thickness Range | Substrate Size | Maximum Load (number of wafers) | Process Temperature Range | Gases | Cleaning Required | Notes | Stylus Tip Radius |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Metal-Organic (MO) CVD |
Aixtron MOCVD - III-N system aix-ccs |
Clean (MOCVD) |
0.00 -
5.00 μm
|
4"x1, 2"X3, pieces |
400 °C - 1300 °C
|
N and P doping available. For Si clean: SC1, SC2, HF dip. For Sapphire clean: SC1, SC2. For GaN template on Si or Sapphire: Piranha, SC1, SC2. |
|||||
| Metal-Organic (MO) CVD |
Aixtron MOCVD - III-V system aix200 |
Flexible |
0.00 -
5.00 μm
|
4"x1 wafer or 2"x1 wafer or 4 pieces |
300 °C - 800 °C
|
Pre-Diffusion Clean |
N and P doping available. For Si clean: SC1, SC2, HF dip. For III-V clean: HCl or HF dip. |