Wet etching refers to processes that use liquid chemicals to remove materials from samples. Important considerations for wet etching processes are the isotropic nature of the etch and it's impact to your desired pattern, the selectivity (ratio of etch rates between materials you want to remove and other materials that will be exposed to the etchant), and chemical safety. When selecting which equipment to use, you will need to consider the type of chemical, the size and shape of your sample, and the Cleanliness (formerly known as Contamination) group.
| Processing Techniques | Equipment name & NEMO ID | Teaser Blurb | Cleanliness | Location |
|---|---|---|---|---|
| Silicon Nitride Wet Etching, Wet Chemical Processing |
Wet Bench Clean_res- hotphos wbclean_res-hotphos |
Semi-automated wet bench for etching silicon nitride from 3", 4", and 6" Si, SiGe, and quartz substrates using 155C phosphoric acid. The baths can hold up to 25 wafers. Part of the Clean Cleanliness Group. |
Clean | SNF Paul G Allen L107 Cleanroom |
| Silicon Oxide Wet Etching, Wet Chemical Processing |
Wet Bench Clean_res-hf wbclean_res-hf |
Semi-automated wet bench for etching oxide from 3", 4", and 6" Si, SiGe, and quartz substrates using 50:1 HF, 6:1BOE, or 20:1BOE. 2 baths can hold up to 25 wafers. Part of the Clean Cleanliness Group. |
Clean | SNF Paul G Allen L107 Cleanroom |
| Aluminum and Titanium and Tungsten Wet Etching, Wet Chemical Processing |
Wet Bench CMOS Metal wbclean3 |
Wet bench part of semiclean cleanliness group to etch Al, Ti, W, or silicon oxide from 3, 4, or 6 inch wafers. The tanks can hold up to 25 wafers. |
Semiclean | SNF Paul G Allen L107 Cleanroom |
| Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing |
Wet Bench Flexcorr 1 wbflexcorr-1 |
Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot plate available. GaAs allowed in personal labware only. |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing |
Wet Bench Flexcorr 2 wbflexcorr-2 |
Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot pots available. GaAs allowed in personal labware only. |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing |
Wet Bench Flexcorr 3 wbflexcorr-3 |
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed. |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing |
Wet Bench Flexcorr 4 wbflexcorr-4 |
Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed. |
Flexible | SNF Paul G Allen L107 Cleanroom |