Resist Exposure Equipment Summary

Resist Exposure Equipment

Processing Techniques	Equipment name (NEMO ID)	Cleanliness	Minimum Resolution	Exposure Wavelength	Substrate Size	Mask Size	Notes
Stepper	ASML PAS 5500/60 i-line Stepper (asml)	All	0.45 μm	365 nm	4"	5 inch	5:1 reducing stepper
Contact Aligner	EVG Contact Aligner (evalign)	All	1.50 μm	350 - 450 nm	Pieces 2" 3" 4" 6"	5 inch, 7 inch	1:1 Contact Aligner. Anodic Bond, backside align, including IR.
Direct Write	Heidelberg MLA 150 (heidelberg)	All	1.00 μm	405 nm	Pieces 2" 3" 4" 6"		Direct Write
Direct Write	Heidelberg MLA 150 - 2 (heidelberg2)	All	0.60 μm	375 nm	Pieces 2" 3" 4" 6"		Direct Write
Contact Aligner	Karl Suss MA-6 Contact Aligner (karlsuss)	All	1.50 μm	365 nm	Pieces 2" 3" 4" 6"	4 inch, 5 inch, 7 inch	1:1 Contact Aligner. Backside align, including IR.
Contact Aligner	Karl Suss MA-6 Contact Aligner (karlsuss2)	All	1.50 μm	365 nm or 405 nm	Pieces 2" 3" 4" 6"	4 inch, 5 inch, 7 inch	1:1 Contact Aligner. Backside align.

Last modified: 30 Apr 2020