Lithography Oven Summary
Lithography Oven Summary
| Processing Techniques | Equipment name (NEMO ID) | Process Temperature Range | Notes | Cleanliness |
|---|---|---|---|---|
| Wafer Prime (HMDS), Singe | HMDS Vapor Prime Oven, YES (yes) |
150 ºC
|
Two programs: Singe and HMDS prime or Singe only. No Resist allowed! |
"All" |
| Wafer Prime (HMDS) | HMDS Vapor Prime Oven, YES2 (yes2) |
150 ºC
|
Singe and prime. No Resist allowed! |
"All" |
| Oven Bake | Oven (White) (white-oven) |
0 °C - 200 °C
|
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable. |
Flexible |
| Resist Post Bake | Oven 110°C post-bake (oven110) |
110 ºC
|
Bakes wafers with resist after the development, called post-bake. |
"All" |
| Resist Prebake | Oven 90°C prebake (oven90) |
90 ºC
|
Bakes wafers after resist coating. |
"All" |
| Oven Bake | Oven BlueM 200°C to 430°C (bluem) |
0 °C - 430 °C
|
Convection in N2. Cure. Programmable. |
Flexible |
| Resist UV Cure | Ultraviolet Photoresist Cure (uvcure) |
|
"All" |
Last modified: 30 Apr 2020
