For photolithography processing SNF houses three types of UV exposure tools: contact aligner, direct write (mask-less) system, and a stepper. All of these systems utilize near-UV sensitive photoresist for pattern transfer. Selection of the appropriate exposure tool depends upon the specifics of the project. Listed in each tool’s webpage specific capabilities such as resolution, alignment, and substrate handling capability are discussed.
| Processing Technique | Equipment name & NEMO ID | Cleanliness | Minimum Resolution | Exposure Wavelength | Substrate Size | Maximum Load (number of wafers) | Mask Size | Notes | Stylus Tip Radius |
|---|---|---|---|---|---|---|---|---|---|
| Stepper |
ASML PAS 5500/60 i-line Stepper asml |
"All" | 0.45 μm | 365 nm | 5 inch |
5:1 reducing stepper |
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| Direct Write |
Heidelberg MLA 150 heidelberg |
"All" | 1.00 μm | 405 nm | 1 |
Direct Write |
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| Direct Write |
Heidelberg MLA 150 - 2 heidelberg2 |
"All" | 0.60 μm | 375 nm | 1 |
Direct Write |
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| Direct Write |
Heidelberg3 heidelberg3 |
"All" | 1 | ||||||
| Contact Aligner |
Karl Suss MA-6 Contact Aligner karlsuss |
"All" | 1.50 μm | 365 nm | 4 inch, 5 inch, 7 inch |
1:1 Contact Aligner. Backside align, including IR. |
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| Contact Aligner |
Karl Suss MA-6 Contact Aligner karlsuss2 |
"All" | 1.50 μm | 365 nm or 405 nm | 4 inch, 5 inch, 7 inch |
1:1 Contact Aligner. Backside align. |